component
AP1509-12ME
Public Made by Adomby adom
HGSEMI DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAP1509-12ME
HGSEMI · DC-DC Converters · ESOP-8
AP1509-12ME from HGSEMI, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Supply voltage input pin that operates from 4.5V to 42V DC and should be bypassed to GND with a suitably large capacitor to eliminate input noise. |
| 2 | OUTPUT | output | Power switch output pin (SW) that is the switch node supplying power to the output; it is driven between VIN and GND, with an absolute maximum of -0.3 V to Vin. |
| 3 | FEEDBACK | input | Feedback pin (FB) that senses the output voltage through an external resistor divider and regulates it to a 1.23 V threshold. |
| 4 | ON/OFF | input | Enable pin where driving it low turns the device on and driving it high turns it off, with floating defaulting low; the pin voltage is rated -0.3 V to Vin. |
| 5 | GND | power_in | Ground pin that must be laid out carefully and placed outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise. |
| 6 | GND | power_in | Ground pin that must be laid out carefully and placed outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise. |
| 7 | GND | power_in | Ground pin that must be laid out carefully and placed outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise. |
| 8 | GND | power_in | Ground pin that must be laid out carefully and placed outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input operation voltage | Vin | 4.5 | 42 | V | 6 | ||
| Output voltage (12V version) | VOUT | 11.52 | 12 | 12.48 | V | Vin = 15V to 42V, Iload=0.2A to 2A | 5 |
| Shutdown supply current | ISTBY | 80 | 200 | uA | VON/OFF=5V | 6 | |
| Quiescent supply current | Iq | 2 | 10 | mA | VON/OFF =0V, VFB =Vin | 6 | |
| Oscillator frequency | Fosc | 127 | 150 | 173 | Khz | 6 | |
| ON/OFF pin threshold, High (Regulator OFF) | VON/OFF | 1.4 | V | High (Regulator OFF) | 6 | ||
| ON/OFF pin threshold, Low (Regulator ON) | VON/OFF | 0.8 | V | Low (Regulator ON) | 6 | ||
| ON/OFF pin input leakage current (OFF) | IH | 5 | 30 | uA | VON/OFF =2.5V (OFF) | 6 | |
| ON/OFF pin input leakage current (ON) | IL | 0.2 | 10 | uA | VON/OFF =0.5V (ON) | 6 | |
| Output saturation voltage | VCE | 1.2 | 1.4 | V | VFB=0V, Iout=2A | 6 | |
| Input voltage (absolute maximum) | Vin | -0.3 | 42 | V | 5 | ||
| Feedback pin voltage (absolute maximum) | VFB | -0.3 | V | Maximum printed as Vin | 5 | ||
| ON/OFF pin voltage (absolute maximum) | VON/OFF | -0.3 | V | Maximum printed as Vin | 5 | ||
| Output switch pin voltage (absolute maximum) | VOutput | -0.3 | V | Maximum printed as Vin | 5 | ||
| Operating junction temperature | TJ | -40 | 125 | ºC | Note2: operating temperature range -40°C to +125°C | 5 | |
| Storage temperature | TSTG | -65 | 150 | ºC | 5 | ||
| Lead temperature | TLEAD | 260 | ºC | Soldering, 10 sec | 5 | ||
| ESD (HBM) | 2000 | V | HBM | 5 |
CAD (KiCad official)
- Symbol:
AP1509-12ME - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
ap1509-12me-etched.step/ap1509-12me-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap1509-12me.step/ap1509-12me.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (13 pp, sha256
8479d2479ebaa956, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).