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Contents

README

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nSMD100

TECHFUSE · Resettable Fuses · 1206

nSMD100 from TECHFUSE, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One of two interchangeable, non-polarized tin-plated nickel-copper terminations of the PPTC; rated Vmax 6.0 Vdc, Ihold 1.00 A, Itrip 1.80 A, Imax 100 A.
2 2 passive Second of two interchangeable, non-polarized tin-plated nickel-copper terminations of the PPTC; rated Vmax 6.0 Vdc, Ihold 1.00 A, Itrip 1.80 A, Imax 100 A.

Key specifications

Parameter Value
Manufacturer TECHFUSE
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Minimum device resistance prior to tripping (Rimin) Rimin 0.055 Ω 25°C still air, prior to tripping 1
Maximum device resistance one hour post reflow (R1max) R1max 0.27 Ω measured one hour post reflow 1
Hold current (Ihold) Ihold 1 A 25°C still air; maximum current device will not trip 1
Trip current (Itrip) Itrip 1.8 A 25°C still air; minimum current at which device will always trip 1
Maximum operating voltage (Vmax) Vmax 6 Vdc at rated current (Imax) 1
Maximum fault current (Imax) Imax 100 A at rated voltage (Vmax) 1
Power dissipation in tripped state (Pd) Pd 0.6 W tripped state, 25°C still air, at rated voltage 1
Max. Current (table column) 8 A table column 'Max. Current' paired with 'Time' 0.30 Sec 1
Time (table column) 0.3 Sec table column 'Time' paired with 'Max. Current' 8.00 A 1
Passive aging resistance change -5 5 % +85°C, 1000 hrs; printed ±5% typical 1
Humidity aging resistance change -5 5 % +85°C, 85% R.H., 168 hours; printed ±5% typical 1
Thermal shock resistance change -33 33 % +85°C to -40°C, 20 times; printed ±33% typical 1
Ambient operating temperature -40 85 °C ambient operating conditions 1
Maximum surface temperature in tripped state 125 °C device in tripped state 1
Hold current vs ambient temperature Ihold 1.45 A ambient -40°C 1
Hold current vs ambient temperature Ihold 1.31 A ambient -20°C 1
Hold current vs ambient temperature Ihold 1.15 A ambient 0°C 1
Hold current vs ambient temperature Ihold 1 A ambient 25°C 1
Hold current vs ambient temperature Ihold 0.84 A ambient 40°C 1
Hold current vs ambient temperature Ihold 0.77 A ambient 50°C 1
Hold current vs ambient temperature Ihold 0.69 A ambient 60°C 1
Hold current vs ambient temperature Ihold 0.61 A ambient 70°C 1
Hold current vs ambient temperature Ihold 0.48 A ambient 85°C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin Terminal pad materials: Tin-plated Nickel-Copper 2

CAD (KiCad official)

  • Symbol: nSMD100
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: nsmd100-etched.step / nsmd100-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsmd100.step / nsmd100.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TECHFUSE datasheet (3 pp, sha256 986063e150e61039, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF