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NSG2113
Public Made by Adomby adom
WXNSIC Gate Drivers, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownNSG2113
WXNSIC · Gate Drivers · SOIC-16-300mil
NSG2113 from WXNSIC, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LO | output | Low-side gate drive output referenced to COM, with short-circuit pulse current IO+/IO- of at least 2 A (typ. 4 A) for PW ≤10 µs. |
| 2 | COM | power_in | Low-side ground return; all voltage ratings in the datasheet are referenced to COM. |
| 3 | VCC | power_in | Low-side supply, recommended 10 V to 20 V, with absolute maximum 25 V referenced to COM. |
| 4 | NC | unconnected | Empty pin with no internal connection, listed as NC in Table 6-1. |
| 5 | NC | unconnected | Empty pin with no internal connection, listed as NC in Table 6-1. |
| 6 | VS | power_in | High-side floating ground reference, recommended range -9 V to 700 V, with dVS/dt tolerance up to 50 V/ns. |
| 7 | VB | power_in | High-side floating supply, recommended VS+10 V to VS+20 V, with absolute maximum 725 V referenced to COM. |
| 8 | HO | output | High-side gate drive output referenced to VS, with short-circuit pulse current IO+/IO- of at least 2 A (typ. 4 A) for PW ≤10 µs. |
| 9 | NC | unconnected | Empty pin with no internal connection, listed as NC in Table 6-1. |
| 10 | NC | unconnected | Empty pin with no internal connection, listed as NC in Table 6-1. |
| 11 | VDD | power_in | Logic supply, recommended VSS+3 V to VSS+20 V, with typical quiescent current IQDD of 15 µA. |
| 12 | HIN | input | High-side logic input referenced to VSS, with VIL max 6 V and VIH min 9.5 V at VCC 10 V to 20 V. |
| 13 | SD | input | Shutdown input that turns off both HO and LO, with shutdown propagation delay tsd of 130 ns typ. and 200 ns max. |
| 14 | LIN | input | Low-side logic input referenced to VSS, with VIL max 6 V and VIH min 9.5 V at VCC 10 V to 20 V. |
| 15 | VSS | power_in | Logic ground reference for HIN, LIN and SD, with recommended offset of -5 V to +5 V relative to COM. |
| 16 | NC | unconnected | Empty pin with no internal connection, listed as NC in Table 6-1. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | WXNSIC |
| Package | SOIC-16-300mil |
| Category | Motor Driver ICs |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side floating supply voltage (absolute max) | VB | -0.3 | 725 | V | 5 | ||
| Low-side supply voltage (absolute max) | VCC | -0.3 | 25 | V | 5 | ||
| Low-side output voltage (absolute max, upper limit VCC+0.3 not numeric) | VLO | -0.3 | V | 5 | |||
| Logic supply voltage (absolute max, upper limit VSS+25 not numeric) | VDD | -0.3 | V | 5 | |||
| Logic input voltage (absolute max, upper limit VCC+0.3 not numeric) | VIN | -0.3 | V | 5 | |||
| Logic ground voltage (absolute max) | VSS | -5 | 5 | V | 5 | ||
| Allowed transient VS slew rate | dVS/dt | 50 | V/ns | 5 | |||
| ESD human body model | ESD | 1.5 | kV | 5 | |||
| ESD machine model | 500 | V | 5 | ||||
| Package power dissipation | PD | 0.625 | W | TA ≤25°C | 5 | ||
| Thermal resistance junction to ambient | RthJA | 200 | °C/W | 5 | |||
| Junction temperature | TJ | 150 | 5 | ||||
| Storage temperature | TS | -55 | 150 | °C | 5 | ||
| Lead temperature | TL | 300 | 5 | ||||
| High-side floating supply voltage (recommended) | VS | -9 | 700 | V | VS and VSS bias ratings measured at 15V supply | 5 | |
| Low-side supply voltage (recommended) | VCC | 10 | 20 | V | 5 | ||
| Low-side output voltage (recommended, upper limit VCC not numeric) | VLO | 0 | V | 5 | |||
| Logic ground compensation voltage (recommended) | VSS | -5 | 5 | V | VS and VSS bias ratings measured at 15V supply | 5 | |
| Logic input voltage (recommended, upper limit VCC not numeric) | VIN | 0 | V | 5 | |||
| Ambient temperature (recommended) | TA | -40 | 125 | °C | 5 | ||
| Turn-on propagation delay | tON | 130 | 200 | ns | VS=0V | 6 | |
| Turn-off propagation delay | tOFF | 130 | 200 | ns | VS=700V | 6 | |
| Shutdown propagation delay | tsd | 130 | 200 | ns | VS=700V | 6 | |
| Turn-on rise time | tR | 25 | 35 | ns | 6 | ||
| Turn-off fall time | tF | 17 | 25 | ns | 6 | ||
| Delay matching time (tON, tOFF) | MT | 10 | ns | 6 | |||
| VCC undervoltage positive threshold | VCCUV+ | 8 | 8.9 | 9.8 | V | 6 | |
| VCC undervoltage negative threshold | VCCUV- | 7.4 | 8.2 | 9 | V | 6 | |
| VBS undervoltage positive threshold | VBSUV+ | 8 | 8.9 | 9.8 | V | 6 | |
| VBS undervoltage negative threshold | VBSUV- | 7.4 | 8.2 | 9 | V | 6 | |
| High-side floating supply leakage current | ILK | 50 | μA | VB=VS=700V | 6 | ||
| VBS quiescent current | IQBS | 70 | 120 | μA | VIN=0V or VDD | 6 | |
| VCC quiescent current | IQCC | 120 | 240 | μA | VIN=0V or VDD | 6 | |
| VDD quiescent current | IQDD | 15 | 30 | μA | VIN=0V or VDD | 6 | |
| High-level input threshold voltage | VIH | 9.5 | V | VCC=10Vto 20V | 6 | ||
| Low-level input threshold voltage | VIL | 6 | V | VCC=10Vto 20V | 6 | ||
| Output high-level voltage drop (VBIAS - VO) | VOH | 1.4 | V | IO=0A | 6 | ||
| Output low-level voltage drop | VOL | 0.1 | V | IO=0A | 6 | ||
| Logic '1' input bias current | IIN+ | 20 | 40 | μA | VIN=VDD | 6 | |
| Logic '0' input bias current | IIN- | 2 | μA | VIN=0V | 6 | ||
| Output high short-circuit pulsed current | IO+ | 2 | 4 | A | VO=0V, VIN=VDD PW≤10us | 6 | |
| Output low short-circuit pulsed current | IO- | 2 | 4 | A | VO=15V VIN=VDD PW≤10us | 6 | |
| VCC undervoltage hysteresis | VCCUVHYS | 0.7 | V | 6 | |||
| VBS undervoltage hysteresis | VBSUVHYS | 0.7 | V | 6 |
CAD (KiCad official)
- Symbol:
NSG2113 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
nsg2113-etched.step/nsg2113-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);nsg2113.step/nsg2113.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: WXNSIC datasheet (10 pp, sha256
4dfeebafba866c8d, retrieved 2026-10-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).