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TPA2005D1DRBQ1

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Texas Instruments Audio Power OpAmps, SON-8-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Contents

README

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TPA2005D1DRBQ1

Texas Instruments · Audio Power OpAmps · SON-8-EP(3x3)

TPA2005D1DRBQ1 from Texas Instruments, in a SON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SHUTDOWN input Shutdown terminal with active-low logic; VIH is 2 V to VDD and VIL is 0 V to 0.7 V.
2 NC unconnected No internal connection.
3 IN+ input Positive differential input.
4 IN- input Negative differential input.
5 VO+ output Positive BTL output.
6 VDD power_in Power supply, 2.5 V to 5.5 V recommended operating range, decoupled with a 0.1 µF ceramic capacitor within 2 mm.
7 GND power_in High-current ground.
8 VO- output Negative BTL output.
9 Thermal Pad power_in Exposed thermal pad that must be soldered to a grounded pad on the PCB and electrically and thermally connected to a ground plane.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SON-8-EP(3x3)
Category Operational Amplifier/Comparator
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (active mode) VDD -0.3 6 V In active mode 4
Supply voltage (shutdown mode) VDD -0.3 7 V In SHUTDOWN mode 4
Input voltage VI -0.3 V max = VDD + 0.3 V 4
Load resistance RL 3.2 Ω 2.5 ≤ VDD ≤ 4.2 V 4
Load resistance RL 6.4 Ω 4.2 < VDD ≤ 6 V 4
Operating free-air temperature TA -40 85 °C Non T-suffix 4
Operating junction temperature TJ -40 150 °C 4
Storage temperature Tstg -65 150 °C 4
ESD HBM V(ESD) -2000 2000 V Human-body model, AEC Q100-002 4
ESD CDM V(ESD) -1000 1000 V Charged-device model, AEC Q100-011 4
Supply voltage VDD 2.5 5.5 V 4
High-level input voltage VIH 2 V SHUTDOWN; max = VDD 4
Low-level input voltage VIL 0 0.7 V SHUTDOWN 4
Input resistor RI 15 kΩ Gain ≤ 20 V/V (26 dB) 4
Common-mode input voltage VIC 0.5 V VDD = 2.5 V, 5.5 V, CMRR ≤ -49 dB; max = VDD, 0.8 V 4
Operating free-air temperature TA -40 85 °C Non T-suffix 4
Junction-to-ambient thermal resistance RθJA 49.5 °C/W DRB (SON) 4
Junction-to-case (top) thermal resistance RθJC(top) 62.1 °C/W DRB (SON) 4
Junction-to-board thermal resistance RθJB 24.8 °C/W DRB (SON) 4
Junction-to-top characterization parameter ψJT 1.3 °C/W DRB (SON) 4
Junction-to-board characterization parameter ψJB 24.9 °C/W DRB (SON) 4
Junction-to-case (bottom) thermal resistance RθJC(bot) 6.9 °C/W DRB (SON) 4
Output offset voltage /VOS/ 25 mV VI = 0 V, AV = 2 V/V, VDD = 2.5 V to 5.5 V 5
Power-supply rejection ratio PSRR -75 -55 dB VDD = 2.5 V to 5.5 V 5
Common-mode rejection ratio CMRR -68 -49 dB VDD = 2.5 V to 5.5 V, VIC = VDD/2 to 0.5 V, VIC = VDD/2 to VDD, 0.8 V, TA = 25°C 5
Common-mode rejection ratio CMRR -35 dB TA = -40°C to 85°C 5
High-level input current /IIH/ 50 μA VDD = 5.5 V, VI = 5.8 V 5
Low-level input current /IIL/ 4 μA VDD = 5.5 V, VI = 0.3 V, TA = -40°C to 85°C 5
Quiescent current I(Q) 3.4 4.5 mA VDD = 5.5 V, no load 5
Quiescent current I(Q) 2.8 mA VDD = 3.6 V, no load 5
Quiescent current I(Q) 2.2 3.2 mA VDD = 2.5 V, no load 5
Shutdown current I(SD) 0.5 2 μA V(SHUTDOWN) = 0.8 V, VDD = 2.5 V to 5.5 V, TA = -40°C to 85°C 5
Switching frequency f(sw) 200 250 300 kHz VDD = 2.5 V to 5.5 V 5
Static drain-source on-state resistance rDS(on) 770 mΩ VDD = 2.5 V 5
Static drain-source on-state resistance rDS(on) 590 mΩ VDD = 3.6 V 5
Static drain-source on-state resistance rDS(on) 500 mΩ VDD = 5.5 V 5
Input impedance ZI 142 150 158 kΩ 5
Output power PO 1.45 W THD+N = 10%, f = 1 kHz, RL = 8 Ω, VDD = 5 V 5
Supply ripple rejection ratio kSVR -71 dB f = 217 Hz, V(RIPPLE) = 200 mVpp, VDD = 3.6 V 5
Output voltage noise Vn 48 μVRMS VDD = 3.6 V, f = 20 Hz to 20 kHz, no weighting 5
Start-up time from shutdown 9 ms VDD = 3.6 V 5

CAD (KiCad official)

  • Symbol: TPA2005D1DRBQ1
  • Footprint: Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
  • 3D model: SON-8-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tpa2005d1drbq1-etched.step / tpa2005d1drbq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa2005d1drbq1.step / tpa2005d1drbq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 2f1ed5eedd67c341, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF