component
PC817X3YSZW
Public Made by Adomby adom
Sharp Microelectronics Transistor, Photovoltaic Output Optoisolators, DIP-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownPC817X3YSZW
Sharp Microelectronics · Transistor, Photovoltaic Output Optoisolators · DIP-4
PC817X3YSZW from Sharp Microelectronics, in a DIP-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | passive | LED anode of the input diode, with forward current IF limited to 50 mA (peak 1 A for pulses ≤100 µs at duty ratio 0.001) and reverse voltage VR of 6 V maximum. |
| 2 | Cathode | passive | LED cathode of the input diode, which is rated for 6 V reverse voltage and 70 mW diode power dissipation. |
| 3 | Emitter | passive | Phototransistor emitter, with emitter-collector voltage VECO rated at 6 V maximum. |
| 4 | Collector | passive | Phototransistor collector, rated for 80 V collector-emitter voltage VCEO, 50 mA collector current IC, and 150 mW collector power dissipation PC. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Sharp Microelectronics |
| Package | DIP-4 |
| Category | Optoisolators |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage | VF | 1.2 | 1.4 | V | IF=20mA | 6 | |
| Peak forward voltage | VFM | 3 | V | IFM=0.5A | 6 | ||
| Reverse current | IR | 10 | μA | VR=4V | 6 | ||
| Terminal capacitance | Ct | 30 | 250 | pF | V=0, f=1kHz | 6 | |
| Dark current | ICEO | 100 | nA | VCE=50V, IF=0 | 6 | ||
| Collector-emitter breakdown voltage | BVCEO | 80 | V | IC=0.1mA, IF=0 | 6 | ||
| Emitter-collector breakdown voltage | BVECO | 6 | V | IE=10μA, IF=0 | 6 | ||
| Collector current (rank C, PC817X3 / PC817X3YSZW) | IC | 10 | 20 | mA | IF=5mA, VCE=5V | 3 | |
| Collector-emitter saturation voltage | VCE(sat) | 0.1 | 0.2 | V | IF=20mA, IC=1mA | 6 | |
| Floating capacitance | Cf | 0.6 | 1 | pF | V=0, f=1MHz | 6 | |
| Cut-off frequency | fc | 80 | kHz | VCE=5V, IC=2mA, RL=100Ω, -3dB | 6 | ||
| Rise time | tr | 4 | 18 | μs | VCE=2V, IC=2mA, RL=100Ω | 6 | |
| Fall time | tf | 3 | 18 | μs | 6 | ||
| Forward current | IF | 50 | mA | 6 | |||
| Peak forward current | IFM | 1 | A | Pulse width ≤100μs, Duty ratio 0.001 | 6 | ||
| Reverse voltage | VR | 6 | V | 6 | |||
| Power dissipation | P | 70 | mW | 6 | |||
| Collector-emitter voltage | VCEO | 80 | V | 6 | |||
| Emitter-collector voltage | VECO | 6 | V | 6 | |||
| Collector current | IC | 50 | mA | 6 | |||
| Collector power dissipation | PC | 150 | mW | 6 | |||
| Total power dissipation | Ptot | 200 | mW | 6 | |||
| Operating temperature | Topr | -30 | 100 | °C | 6 | ||
| Storage temperature | Tstg | -55 | 125 | °C | 6 | ||
| Isolation voltage | Viso(rms) | 5 | kV | AC for 1 min, 40 to 60%RH | 6 | ||
| Soldering temperature | Tsol | 270 | °C | For 10 s | 6 | ||
| Maximum operating isolation voltage (VDE, peak) | VIORM | 890 | V | Peak; per DIN EN 60747-5-5 (Y option) | 13 | ||
| Maximum over-voltage (VDE, peak) | Vini,a | 9000 | V | tINI=60s; per DIN EN 60747-5-5 (Y option) | 13 | ||
| Case temperature (safety maximum) | Tsi | 150 | °C | IF=0, PC=0; VDE safety limit (Y option) | 13 | ||
| Input current (safety maximum) | Isi | 200 | mA | PC=0; VDE safety limit (Y option) | 13 | ||
| Electric power (safety maximum) | Psi | 300 | mW | Output or total power dissipation; VDE safety limit (Y option) | 13 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper Alloy | Pin material : Copper Alloy | 5 |
CAD (KiCad official)
- Symbol:
PC817X3YSZW - Footprint:
Package_DIP:DIP-4_W7.62mm - 3D model: DIP-4 (KiCad packages3D, STEP)
- 3D model files:
pc817x3yszw-etched.step/pc817x3yszw-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pc817x3yszw.step/pc817x3yszw.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Sharp Microelectronics datasheet (15 pp, sha256
e2cec0f8d86f5db0, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).