Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SZMMSZ3V6T1G

onsemi · Zener Diodes · SOD-123

SZMMSZ3V6T1G from onsemi, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal, indicated on the package by the polarity band, as stated in the Mechanical Characteristics and the Style 1 pin assignment.
2 Anode passive Anode terminal, opposite the cathode polarity band, as given in the Style 1 pin assignment of the SOD-123 outline.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage (nominal VZ1 at IZT1) VZ1 3.42 3.6 3.78 V @ IZT1 = 5 mA; PW = 1 ms (Notes 3, 4) 2
Standard tolerance on nominal Zener voltage VZ -5 5 % Standard tolerance on nominal Zener voltage (Note 3) 2
Reverse Zener Voltage (VZ2 at IZT2) VZ2 2.7 3.3 V @ IZT2 = 1 mA 2
Maximum Zener Impedance (ZZT1) ZZT1 90 Ω @ IZT1 = 5 mA; IZ(AC) = 0.1 IZ(DC), f = 1 kHz (Note 5) 2
Maximum Zener Impedance (ZZT2) ZZT2 600 Ω @ IZT2 = 1 mA; IZ(AC) = 0.1 IZ(DC), f = 1 kHz (Note 5) 2
Maximum Reverse Leakage Current IR 5 µA @ VR = 1 V 2
Forward Voltage VF 0.9 V @ IF = 10 mA 2
Total Power Dissipation on FR-5 Board PD 500 mW @ TL = 75°C (Note 1, FR-5 = 3.5 x 1.5 inches) 1
Power dissipation derating PD 6.7 mW/°C Derated above 75°C 1
Thermal Resistance, Junction-to-Ambient RθJA 340 °C/W Note 2 (infrared scan method) 1
Thermal Resistance, Junction-to-Lead RθJL 150 °C/W Note 2 (infrared scan method) 1
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PPA • ESD Rating of Class 3 (> 16 kV) per Human Body Model • AEC−Q101 Qualified and PPAP Capable 1

CAD (KiCad official)

  • Symbol: SZMMSZ3V6T1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: szmmsz3v6t1g-etched.step / szmmsz3v6t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); szmmsz3v6t1g.step / szmmsz3v6t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 4fc8c848a6340ce2, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF