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Contents

README

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AT21CS01-STUM11-T

Microchip Tech · EEPROM · SOT-23-3

AT21CS01-STUM11-T from Microchip Tech, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 SI/O bidirectional Open-drain bidirectional serial input/output pin that must be pulled high with an external pull-up resistor and also supplies device power when pulled high to 1.7V to 3.6V for AT21CS01.
2 NC unconnected No Connect pin on the 3-Lead SOT23 package.
3 GND power_in Ground reference for the power supply, which should be connected to the system ground.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23-3
Category Memory
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Pull-up Voltage VPUP 1.7 3.6 V High-Speed mode 8
Pull-up Voltage VPUP 2.7 3.6 V Standard Speed mode 8
Pull-up Resistance RPUP 130 200 Ω VPUP = 1.7V 8
Pull-up Resistance RPUP 0.2 1.8 kΩ VPUP = 2.7V 8
Pull-up Resistance RPUP 0.33 4 kΩ VPUP = 3.6V 8
Active Current, Read IA1 0.08 0.3 mA VPUP = 3.6V; SI/O = VPUP 8
Active Current, Write IA2 0.2 0.5 mA VPUP = 3.6V 8
Standby Current ISB 0.6 1.5 µA VPUP = 1.8V; SI/O = VPUP; Industrial 8
Standby Current ISB 0.6 3 µA VPUP = 1.8V; SI/O = VPUP; Extended 8
Standby Current ISB 0.7 2.5 µA VPUP = 3.6V; Industrial 8
Standby Current ISB 0.7 4 µA VPUP = 3.6V; Extended 8
Input Low Level VIL -0.6 0.5 V 8
SI/O Hysteresis VHYS 0.128 1.17 V 8
Output Low Level VOL 0 0.4 V IOL = 4 mA 8
Bus Capacitance CBUS 1000 pF 8
Temperature under bias -55 125 °C 8
Storage temperature -65 150 °C 8
Voltage on any pin with respect to ground -0.6 V Printed upper limit VPUP + 0.5V (formula, not numeric) 8
DC output current 15 mA 8
Operating Temperature (Case), Industrial Temperature Range -40 85 °C AT21CS01 Industrial range 8
Operating Temperature (Case), Extended Temperature Range -40 125 °C AT21CS01 Extended range 8
Reset Low Time, Device in Inactive State tRESET 480 µs Standard Speed mode 9
Reset Low Time, Device in Inactive State tRESET 96 µs High Speed mode 9
Discharge Low Time, Device in Active Write Cycle (tWR) tDSCHG 150 µs Standard Speed mode 9
Reset Recovery Time tRRT 8 µs High Speed mode 10
Discovery Response Request tDRR 1 µs High Speed mode; printed max 2 - tPUP (formula) 10
Discovery Response Acknowledge Time tDACK 8 24 µs High Speed mode 10
Host Strobe Discovery Response Time tMSDR 2 6 µs High Speed mode 10
SI/O High Time for Start/Stop Condition tHTSS 150 µs High Speed mode; reset and discovery table 10
Bit Frame Duration tBIT 40 100 µs Standard Speed mode; input and output bit frame 10
Bit Frame Duration tBIT 25 µs High Speed mode; input and output bit frame; printed min tLOW0 + tPUP + tRCV (formula) 10
SI/O High Time for Start/Stop Condition tHTSS 600 µs Standard Speed mode; input bit frame 10
SI/O Low Time, Logic '0' Condition tLOW0 24 64 µs Standard Speed mode; input bit frame 10
SI/O Low Time, Logic '0' Condition tLOW0 6 16 µs High Speed mode; input bit frame 10
SI/O Low Time, Logic '1' Condition tLOW1 4 8 µs Standard Speed mode; input bit frame 10
SI/O Low Time, Logic '1' Condition tLOW1 1 2 µs High Speed mode; input bit frame 10
Host SI/O Low Time During Read tRD 4 µs Standard Speed mode; output bit frame; printed max 8 - tPUP (formula) 10
Host SI/O Low Time During Read tRD 1 µs High Speed mode; output bit frame; printed max 2 - tPUP (formula) 10
Host Read Strobe Time tMRS 8 µs Standard Speed mode; output bit frame; printed min tRD + tPUP (formula) 10
Host Read Strobe Time tMRS 2 µs High Speed mode; output bit frame; printed min tRD + tPUP (formula) 10
Data Output Hold Time (Logic '0') tHLD0 8 24 µs Standard Speed mode; output bit frame 10
Data Output Hold Time (Logic '0') tHLD0 2 6 µs High Speed mode; output bit frame 10
Client Recovery Time tRCV 8 µs Standard Speed mode; input and output bit frame 10
Client Recovery Time tRCV 2 µs High Speed mode; input and output bit frame; printed max is note 5 (formula) 10
Noise Filtering Capability on SI/O tNOISE 0.5 µs Standard Speed mode; input bit frame 10
Write Cycle Time (tWR) tWR 5 ms VPUP (min.) < VPUP < VPUP (max.), TA = 25°C, Byte or Page Write mode 11
Write Endurance 1e+06 Write Cycles VPUP (min.) < VPUP < VPUP (max.), TA = 25°C, Byte or Page Write mode 11
Data Retention 100 Years TA = 55°C 11

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2022 Microchip Technology Inc. 43

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: AT21CS01-STUM11-T
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: at21cs01-stum11-t-etched.step / at21cs01-stum11-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at21cs01-stum11-t.step / at21cs01-stum11-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (55 pp, sha256 0750346a5e6f119a, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF