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HGV8332M
Public Made by Adomby adom
HGSEMI Operational Amplifier, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHGV8332M
HGSEMI · Operational Amplifier · SOP-8
HGV8332M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Amplifier A output, rail-to-rail swing. |
| 2 | INA- | input | Amplifier A inverting input; common-mode range extends to VSS-0.1V to VDD+0.1V. |
| 3 | INA+ | input | Amplifier A non-inverting input; common-mode range extends to VSS-0.1V to VDD+0.1V. |
| 4 | VSS | power_in | Negative supply or ground; for dual-supply operation bypass with a 0.1µF ceramic capacitor. |
| 5 | INB+ | input | Amplifier B non-inverting input; common-mode range extends to VSS-0.1V to VDD+0.1V. |
| 6 | INB- | input | Amplifier B inverting input; common-mode range extends to VSS-0.1V to VDD+0.1V. |
| 7 | OUTB | output | Amplifier B output, rail-to-rail swing. |
| 8 | VDD | power_in | Positive supply, 1.8V to 5.5V single supply; place a 0.1µF ceramic bypass capacitor close to this pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | 2 | 10 | µV | 4 | ||
| Power Supply Voltage (VDD to Vss) | VDD | -0.5 | 7.5 | V | 3 | ||
| PDB Input Voltage | 7 | V | 3 | ||||
| Operating Temperature Range | -45 | 125 | °C | 3 | |||
| Storage Temperature Range | -55 | 150 | °C | 3 | |||
| Junction Temperature | 160 | °C | 3 | ||||
| Lead Temperature (soldering) | 245 | °C | soldering, 10 sec | 3 | |||
| ESD Susceptibility HBM | 6 | KV | HBM | 3 | |||
| ESD Susceptibility MM | 400 | V | MM | 3 | |||
| Single-Supply Operating Voltage | 1.8 | 5.5 | V | single supply | 1 | ||
| Package Thermal Resistance, junction-to-ambient (SOP-8) | θJA | 125 | °C/W | TA=+25℃ | 3 |
CAD (KiCad official)
- Symbol:
HGV8332M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hgv8332m-etched.step/hgv8332m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgv8332m.step/hgv8332m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (14 pp, sha256
5955e531301eee19, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).