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Contents

README

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TJA1049T

NXP Semicon · CAN ICs · SO-8

TJA1049T from NXP Semicon, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TXD input Transmit data input (TXD) receives the data to be sent onto the CAN bus.
2 GND power_in Ground supply; the datasheet states this pin must be soldered to board ground.
3 VCC power_in Supply voltage (VCC) for the transceiver.
4 RXD output Receive data output (RXD) reads out data from the bus lines.
5 SPLIT output Common-mode stabilization output (SPLIT), present on TJA1049T and TJA1049TK only; on the TJA1049T/3 this pin is VIO instead.
6 CANL bidirectional LOW-level CAN bus line (CANL).
7 CANH bidirectional HIGH-level CAN bus line (CANH).
8 STB input Standby mode control input (STB); a LOW level selects Normal mode and a HIGH level selects Standby mode.

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package SO-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage on pin x (CANH, CANL, SPLIT) Vx -58 58 V on pins CANH, CANL and SPLIT 9
Voltage on any other pin Vx -0.3 7 V on any other pin 9
Voltage between pin CANH and pin CANL V(CANH-CANL) -27 27 V 9
Transient voltage pulse 1 on CANH, CANL Vtrt -100 V pulse 1 9
Transient voltage pulse 2a on CANH, CANL Vtrt 75 V pulse 2a 9
Transient voltage pulse 3a on CANH, CANL Vtrt -150 V pulse 3a 9
Transient voltage pulse 3b on CANH, CANL Vtrt 100 V pulse 3b 9
Electrostatic discharge voltage IEC 61000-4-2 at pins CANH and CANL VESD -8 8 kV IEC 61000-4-2 (150 pF, 330 Ω) 9
Electrostatic discharge voltage HBM at pins CANH and CANL VESD -8 8 kV Human Body Model (HBM); 100 pF, 1.5 kΩ; at pins CANH and CANL 9
Electrostatic discharge voltage HBM at any other pin VESD -4 4 kV Human Body Model (HBM); 100 pF, 1.5 kΩ; at any other pin 9
Electrostatic discharge voltage Machine Model at any pin VESD -300 300 V Machine Model (MM); 200 pF, 0.75 µH, 10 Ω 9
Electrostatic discharge voltage CDM at corner pins VESD -750 750 V Charged Device Model (CDM); field induced charge; 4 pF; at corner pins 9
Virtual junction temperature Tvj -40 150 C 9
Storage temperature Tstg -55 150 C 9
VCC supply voltage VCC 4.75 5.25 V 10
Undervoltage detection voltage on pin VCC Vuvd(VCC) 3.5 4.75 V 10
Supply current Standby mode TJA1049T or TJA1049TK ICC 10 15 µA includes IIO; VTXD =VIO 10
Supply current Normal mode recessive ICC 2.5 5 7.5 mA recessive; VTXD =VIO 10
Supply current Normal mode dominant ICC 20 45 65 mA dominant; VTXD =0V 10
Supply current Normal mode dominant short circuit on bus lines ICC 2.5 77.5 107.5 mA dominant; VTXD = 0 V; short circuit on bus lines; 3 V VCANH = VCANL +18 V 10
HIGH-level input current on pin TXD IIH -5 5 µA VTXD =VIO 10
LOW-level input current on pin TXD IIL -260 -150 -30 µA VTXD =0V 10
Input capacitance on pin TXD Ci 5 10 pF 10
HIGH-level output current on pin RXD TJA1049T or TJA1049TK IOH -8 -3 -1 mA VRXD =VCC - 0.4 V 10
LOW-level output current on pin RXD IOL 1 12 mA VRXD = 0.4 V; bus dominant 11
Dominant output voltage pin CANH VO(dom) 2.75 3.5 4.5 V VTXD = 0 V; t < tto(dom)TXD; RL = 50 Ω to 65 Ω 11
Dominant output voltage pin CANL VO(dom) 0.5 1.5 2.25 V VTXD = 0 V; t < tto(dom)TXD; RL = 50 Ω to 65 Ω 11
Transmitter dominant voltage symmetry Vdom(TX)sym -400 400 mV Vdom(TX)sym = VCC - VCANH - VCANL 11
Differential output voltage dominant RL 45 to 70 Ω VO(dif) 1.5 3 V dominant; Normal mode; VTXD = 0 V; t<tto(dom)TXD; VCC = 4.75 V to 5.25 V; RL = 45 Ω to 70 Ω 11
Differential output voltage dominant RL 2240 Ω VO(dif) 1.5 5 V dominant; Normal mode; VTXD = 0 V; t<tto(dom)TXD; VCC = 4.75 V to 5.25 V; RL = 2240 Ω 11
Differential output voltage recessive Normal mode VO(dif) -50 50 mV recessive; no load; Normal mode: VTXD =VIO 11
Differential output voltage recessive Standby mode VO(dif) -0.2 0.2 V recessive; Standby mode 11
Recessive output voltage Normal mode VO(rec) 2 3 V Normal mode; VTXD =VIO; no load 11
Recessive output voltage Standby mode VO(rec) -0.1 0.1 V Standby mode; no load 11
Differential receiver threshold voltage Normal mode Vth(RX)dif 0.5 0.9 V -12 V ≤ VCANL ≤ +12 V; -12 V ≤ VCANH ≤ +12 V; Normal mode 11
Differential receiver threshold voltage Standby mode Vth(RX)dif 0.4 1.15 V -12 V ≤ VCANL ≤ +12 V; -12 V ≤ VCANH ≤ +12 V; Standby mode 11
Receiver recessive voltage Normal mode Vrec(RX) -4 0.5 V -12 V ≤ VCANL ≤ +12 V; -12 V ≤ VCANH ≤ +12 V; Normal mode 11
Receiver recessive voltage Standby mode Vrec(RX) -4 0.4 V -12 V ≤ VCANL ≤ +12 V; -12 V ≤ VCANH ≤ +12 V; Standby mode 11
Receiver dominant voltage Normal mode Vdom(RX) 0.9 9 V -12 V ≤ VCANL ≤ +12 V; -12 V ≤ VCANH ≤ +12 V; Normal mode 11
Receiver dominant voltage Standby mode Vdom(RX) 1.15 9 V -12 V ≤ VCANL ≤ +12 V; -12 V ≤ VCANH ≤ +12 V; Standby mode 11
Differential receiver hysteresis voltage Vhys(RX)dif 100 300 mV -12 V ≤ VCANL ≤ +12 V; -12 V ≤ VCANH ≤ +12 V; Normal mode 11
Dominant short-circuit output current pin CANH IO(sc)dom -100 -70 -40 mA VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V; pin CANH; VCANH = -15 V to +40 V 11
Dominant short-circuit output current pin CANL IO(sc)dom 40 70 100 mA VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V; pin CANL; VCANL = -15 V to +40 V 11
Leakage current IL -3 3 µA VCC =VIO = 0 V or VCC =VIO = shorted to GND via 47 kΩ; VCANH =VCANL =5V 11
Input resistance Ri 9 15 28 kΩ 2 V ≤ VCANL ≤ +7 V; 2 V ≤ VCANH ≤ +7 V 11
Input resistance deviation Ri -3 3 % 0 V ≤ VCANL ≤ +5 V; 0 V ≤ VCANH ≤ +5 V 11
Differential input resistance Ri(dif) 19 30 52 kΩ 2 V ≤ VCANL ≤ +7 V; 2 V ≤ VCANH ≤ +7 V 12
Common-mode input capacitance Ci(cm) 20 pF 12
Differential input capacitance Ci(dif) 10 pF 12
Transceiver delay TXD to RXD SPLIT versions (LOW) td(TXDL-RXDL) 60 220 ns versions with SPLIT pin; Normal mode 12
Transceiver delay TXD to RXD SPLIT versions (HIGH) td(TXDH-RXDH) 60 220 ns versions with SPLIT pin; Normal mode 13
Transmitted recessive bit width tbit(bus) 435 530 ns tbit(TXD) = 500 ns 13
Transmitted recessive bit width tbit(bus) 155 210 ns tbit(TXD) = 200 ns 13
Bit time on pin RXD tbit(RXD) 400 550 ns tbit(TXD) = 500 ns 13
Bit time on pin RXD tbit(RXD) 120 220 ns tbit(TXD) = 200 ns 13
Receiver timing symmetry trec -65 40 ns tbit(TXD) = 500 ns 13
Receiver timing symmetry trec -45 15 ns tbit(TXD) = 200 ns 13
TXD dominant time-out time tto(dom)TXD 0.3 2 5 ms VTXD = 0 V; Normal mode 13
Thermal resistance from junction to ambient SO8 package Rth(j-a) 145 K/W SO8 package; in free air 9

CAD (KiCad official)

  • Symbol: TJA1049T
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: tja1049t-etched.step / tja1049t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tja1049t.step / tja1049t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (27 pp, sha256 c43c88ebded0efdb, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF