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Contents

README

markdown

SXL1509-12E1

JSMSEMI · DC-DC Converters · SOP-8

SXL1509-12E1 from JSMSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Positive supply voltage input for the IC switching regulator. Absolute max +40V; operating 4.5V-40V (15V-40V for the -12V fixed version). Requires a local bypass capacitor to supply switching currents and minimize voltage transients.
2 Output output Power switching output (internal 3A NPN switch emitter). Voltage swings between (+VIN − VSAT) and approximately −0.5V with a duty cycle of ~VOUT/VIN. Connects to the external inductor and Schottky catch diode; PCB copper area at this node should be minimized to reduce EMI coupling.
3 FB input Output voltage feedback control input. Senses the regulated output voltage (directly for fixed-V versions, or via an R1/R2 divider for the ADJ version where VFB = 1.23V typ, VOUT = VFB·(1+R1/R2)). Feedback bias current ~50nA (adjustable version).
4 EN input ON/OFF shutdown logic input. Pulling EN below ~1.3V (VIL ≤ 0.6V) enables the regulator; pulling above ~1.3V (VIH ≥ 2.0V) shuts it down and drops supply current to ~150µA (standby IQ typ 50µA). Tie to GND if shutdown is not used. Absolute max −0.3V to VIN.
5 GND power_in Circuit ground. Pins 5, 6, 7, and 8 are all tied to GND on the SOP-8 package and should all be connected to the ground plane to provide the return path and improve thermal dissipation (θJA ≈ 70 °C/W with ~3 in² copper).
6 GND power_in Circuit ground. Tie to the same ground plane as pins 5/7/8; multiple GND pins also aid heat conduction out of the package.
7 GND power_in Circuit ground. Tie to the same ground plane as pins 5/6/8.
8 GND power_in Circuit ground. Tie to the same ground plane as pins 5/6/7 for lowest impedance return and best thermal performance.

Key specifications

Parameter Value
Manufacturer JSMSEMI
Package SOP-8
Category PMIC
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • SXL1509-12E1

CAD (KiCad official)

  • Symbol: SXL1509-12E1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
sxl1509-12e1.step 122 KB You want the bare part, or you mark your own boards.
sxl1509-12e1-etched.step 2.2 MB You want the part with SXL1509-12E1 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 546 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: JSMSEMI datasheet (9 pp, sha256 b150b49cc114c141, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF