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Contents

README

markdown

D3V3L1B2WS-7

Diodes Incorporated · ESD And Surge Protection (TVS/ESD) · SOD-323

D3V3L1B2WS-7 from Diodes Incorporated, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation.
2 2 passive Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power Dissipation PPP 90 W 8/20μs, per Figure 3 2
Peak Pulse Current IPP 5 A 8/20μs, per Figure 3 2
ESD Protection, Contact Discharge VESD_Contact -26 26 kV Standard IEC 61000-4-2 2
ESD Protection, Air Discharge VESD_Air -26 26 kV Standard IEC 61000-4-2 2
Reverse Working Voltage VRWM 3.3 V 2
Reverse Current IR 0.05 0.5 μA VR = VRWM = 3.3V 2
Punch Through Voltage VPT 3.5 V IR = 2μA 2
Snap-Back Voltage VSB 2.8 V IR = 50mA 2
Reverse Clamping Voltage VCL 6 8 V IPP = 1A, tp = 8/20μs 2
Reverse Clamping Voltage VCL 8.5 18 V IPP = 5A, tp = 8/20μs 2
Capacitance CT 11 15 pF VR = 0V, f = 1MHz 2
Package Power Dissipation PD 250 mW Note 5: device mounted on FR-4 PCB pad layout (2oz copper) 2
Thermal Resistance, Junction to Ambient RƟJA 500 C/W Note 5: device mounted on FR-4 PCB pad layout (2oz copper) 2
Operating Temperature Range TJ -55 125 C 2
Storage Temperature Range TSTG -55 150 C 2
Soldering Temperature TL 260 C t max = 10s 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: D3V3L1B2WS-7
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: d3v3l1b2ws-7-etched.step / d3v3l1b2ws-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); d3v3l1b2ws-7.step / d3v3l1b2ws-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 acebb68024d407a4, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF