component
BZX584C39
Public Made by Adomby adom
hongjiacheng Zener Diodes, SOD-523. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBZX584C39
hongjiacheng · Zener Diodes · SOD-523
BZX584C39 from hongjiacheng, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the Zener diode, marked by the cathode band on the SOD-523 package; reverse Zener voltage for BZX584C39 is 37 V min, 39 V nom, 41 V max at IZT = 2 mA. |
| 2 | A | passive | Anode of the Zener diode; forward voltage is 0.9 V at IF = 10 mA and power dissipation is limited to 150 mW. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | hongjiacheng |
| Package | SOD-523 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Nominal Zener voltage | VZ | 37 | 39 | 41 | V | @ IZT (table row test current 2 mA) | 2 |
| Maximum Zener impedance | ZZT | 130 | Ω | @ IZT = 2 mA | 2 | ||
| Maximum Zener impedance | ZZK | 350 | Ω | @ IZK = 0.5 mA | 2 | ||
| Typical temperature coefficient | 33.4 | 41.2 | mV/℃ | Typical, @ IZT per Fig.3 note | 2 | ||
| Reverse leakage current | IR | 0.1 | μA | @ VR = 27.3 V | 2 | ||
| Power dissipation | PD | 150 | mW | Ta=25℃ unless otherwise specified | 1 | ||
| Storage temperature | Tstg | -55 | 150 | ℃ | 1 | ||
| Junction temperature | Tj | -55 | 150 | ℃ | 1 | ||
| Typical thermal resistance, junction to ambient | RθJ-A | 833 | ℃/W | 1 | |||
| Forward voltage | VF | 0.9 | V | @ IF=10mA | 1 |
CAD (KiCad official)
- Symbol:
BZX584C39 - Footprint:
Diode_SMD:D_SOD-523 - 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files:
bzx584c39-etched.step/bzx584c39-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bzx584c39.step/bzx584c39.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: hongjiacheng datasheet (4 pp, sha256
c4ac9f75220354ce, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).