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Contents

README

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SVF65R950CDTR

Hangzhou Silan Microelectronics · MOSFETs · TO-252-2L

SVF65R950CDTR from Hangzhou Silan Microelectronics, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the 650V N-channel MOSFET; gate-source voltage is rated ±30 V (VGS).
2 D passive Drain terminal; drain-source voltage is rated 650 V (VDS) and continuous drain current is 9 A at TC=25°C.
3 S passive Source terminal; source diode continuous current is rated 9 A (IS) and pulsed current 36 A (ISM).

Key specifications

Parameter Value
Manufacturer Hangzhou Silan Microelectronics
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
漏源击穿电压 (Drain-source breakdown voltage) BVDSS 650 V VGS=0V,ID=250µA 2
漏源漏电流 (Drain-source leakage current) IDSS 1 µA VDS=650V,VGS=0V 2
栅源漏电流 (Gate-source leakage current) IGSS -100 100 nA VGS=±30V,VDS=0V 2
栅极开启电压 (Gate threshold voltage) VGS(th) 2 4 V VGS=VDS,ID=250µA 2
导通电阻 (Static drain-source on-resistance) RDS(on) 0.85 0.98 Ω VGS=10V,ID=4.5A 2
源极电流 (Continuous source current, body diode) IS 9 A MOS管中源极、漏极构成的反偏P-N结 2
源极脉冲电流 (Pulsed source current) ISM 36 A 2
源-漏二极管压降 (Diode forward voltage) VSD 1.4 V IS=9A,VGS=0V 2
漏源电压 (Drain-source voltage) VDS 650 V 1
栅源电压 (Gate-source voltage) VGS -30 30 V 1
漏极电流 (Drain current) ID 9 A TC=25°C 1
漏极电流 (Drain current) ID 5.7 A TC=100°C 1
漏极冲击电流 (Pulsed drain current) IDM 36 A 1
耗散功率 (Power dissipation) PD 148 W TC=25°C 1
耗散功率降额 (Power dissipation derating) PD 1.18 W/C 大于25C 每摄氏度减少 1
单脉冲雪崩能量 (Single pulse avalanche energy) EAS 565 mJ 注1: L=30mH,IAS=5.8A,VDD=100V,RG=25,开始温度 TJ=25C 1
工作结温范围 (Operating junction temperature range) TJ -55 150 C 1
贮存温度范围 (Storage temperature range) Tstg -55 150 C 1
芯片对管壳热阻 (Junction-to-case thermal resistance) RθJC 0.82 C/W 2
芯片对环境的热阻 (Junction-to-ambient thermal resistance) RθJA 62 C/W 2

CAD (KiCad official)

  • Symbol: SVF65R950CDTR
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: svf65r950cdtr-etched.step / svf65r950cdtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); svf65r950cdtr.step / svf65r950cdtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Hangzhou Silan Microelectronics datasheet (7 pp, sha256 9e1f4b4c16e1fe6b, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF