component
LX3400L
Public Made by Adomby adom
ChipLink Tech MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLX3400L
ChipLink Tech · MOSFETs · SOT-23
LX3400L from ChipLink Tech, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; the device operates with gate voltage as low as 2.5V, with a maximum gate-source voltage of ±12V. |
| 2 | S | passive | Source of the N-channel MOSFET, with continuous drain current rated 5.1A. |
| 3 | D | passive | Drain of the N-channel MOSFET, with a maximum drain-source voltage of 30V and pulsed drain current of 20A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ChipLink Tech |
| Package | SOT-23 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 30 | V | VGS=0V, ID=250uA | 2 | ||
| Gate-Threshold Voltage | Vth(GS) | 0.7 | 0.9 | 1.2 | V | VDS= VGS, ID=250 uA | 2 |
| Gate-body Leakage | IGSS | -100 | 100 | nA | VDS=0V, VGS=±12V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | uA | VDS=30V, VGS=0V | 2 | ||
| Drain-Source On-Resistance | RDS(ON) | 24 | 33 | mΩ | VGS=10V, ID=5A | 2 | |
| Drain-Source On-Resistance | RDS(ON) | 26 | 39 | mΩ | VGS=4.5V, ID=4A | 2 | |
| Drain-Source On-Resistance | RDS(ON) | 33 | 55 | mΩ | VGS=2.5V, ID=3A | 2 | |
| Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, ID=5A | 2 | ||
| Diode Forward Current | Is | 5.1 | A | 2 | |||
| Drain-Source Voltage | VDS | 30 | V | TA=25℃ | 1 | ||
| Gate-Source Voltage | VGS | -12 | 12 | V | TA=25℃ | 1 | |
| Continuous Drain Current | ID | 5.1 | A | TA=25℃ | 1 | ||
| Pulsed Drain Current | IDM | 20 | A | Repetitive; pulse width limited by TJ(MAX)=150℃ | 1 | ||
| Maximum Power Dissipation | PD | 1.3 | W | TJ(MAX)=150℃, ≤10s junction-to-ambient | 1 | ||
| Junction and Storage Temperature Range | TJ, TSTG | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance, Junction to Ambient | RQJA | 96 | ℃/W | Junction to ambient | 1 |
CAD (KiCad official)
- Symbol:
LX3400L - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
lx3400l-etched.step/lx3400l-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lx3400l.step/lx3400l.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ChipLink Tech datasheet (7 pp, sha256
6c2825c81a352c1f, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).