H3.0SMCJ30A13
Public Made by Adomby adom
HXY MOSFET ESD And Surge Protection (TVS/ESD), SMC(DO-214AB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownH3.0SMCJ30A13
HXY MOSFET · ESD And Surge Protection (TVS/ESD) · SMC(DO-214AB)
H3.0SMCJ30A13 from HXY MOSFET, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SMC(DO-214AB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off voltage | VRWM | 30 | V | 1 | |||
| Breakdown voltage | VBR | 33.3 | 36.8 | V | @IT = 1 mA | 1 | |
| Test current | IT | 1 | mA | 1 | |||
| Maximum clamping voltage | VC | 48.4 | V | @IPP = 31.0 A | 1 | ||
| Peak pulse current | IPP | 31 | A | 1 | |||
| Reverse leakage current | IR | 1 | μA | @VRWM | 1 | ||
| Peak pulse power dissipation | PPPM | 1500 | W | 10/1000μs waveform | 1 | ||
| Steady state power dissipation | PM(AV) | 6.5 | W | TA=50℃ | 1 | ||
| Peak forward surge current | IFSM | 200 | A | 8.3ms single half sine-wave superimposed on rated load | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -65 | 150 | °C | 1 | ||
| Thermal resistance junction to lead | RθJL | 15 | °C/W | Typical | 1 | ||
| Thermal resistance junction to ambient | RθJA | 75 | °C/W | Typical | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. | 1 |
CAD (KiCad official)
- Symbol:
H3.0SMCJ30A13 - Footprint:
Diode_SMD:D_SMC - 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files:
h3-0smcj30a13-etched.step/h3-0smcj30a13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);h3-0smcj30a13.step/h3-0smcj30a13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (4 pp, sha256
4ede5293f4ea3968, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).