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Contents

README

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SX2B32.000F1210F30

Shenzhen SCTF Elec · Crystals · SMD2520-4P

SX2B32.000F1210F30 from Shenzhen SCTF Elec, in a SMD2520-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 XTAL1 passive Crystal terminal 1 (pin-1 pad with chamfered corner), one side of the 32.000MHz resonator with 12pF load capacitance.
2 NC/COVER passive Connected to the metal cover; the datasheet says to connect it to GND or leave it floating.
3 XTAL2 passive Crystal terminal 2, the other side of the 32.000MHz resonator with 12pF load capacitance.
4 NC/COVER passive Connected to the metal cover; the datasheet says to connect it to GND or leave it floating.

Key specifications

Parameter Value
Manufacturer Shenzhen SCTF Elec
Package SMD2520-4P
Category Crystals, Oscillators, Resonators
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Frequency tolerance (常温频差) △f/f -10 10 ppm at 25℃±2℃ 3
Temperature drift (温度频差) f_tem -30 30 ppm Over operating temp. range (reference 25℃) 3
Aging (年老化率) f_age -3 3 ppm 1st year 3
Shunt capacitance (静电容) C0 3 pF 3
Effective resistance (谐振电阻) RR 12.5 Ω Fundamental 3
Insulation resistance (绝缘阻抗) IR 500 MΩ at DC 100V 3
Drive level (激励功率) DL 10 100 µW 3
Spurious response (寄生响应) SPDB -3 dB 3
Operating temperature range (工作温度范围) T_use -40 85 ℃ 3
Storage temperature range (存储温度) T_stg -55 125 ℃ 3
Frequency change after reliability tests △FL -5 5 ppm After each reliability test (items 1-13) 7
Resistance change after reliability tests △RR 10 % of RR(max) After each reliability test (items 1-13) 7
Soldering tin rate 90 % Soldering test (item 13) 7
Ramp-up rate (TL to Tp) 3 °C/second Ramp-up rate (TL to Tp) 6
Ramp-down rate (Tp to TL) 6 °C/second Ramp-down rate (Tp to TL) 6
Reflow times 3 times 6
Nominal frequency (标称频率) f 32 MHz 3
Load capacitance (负载电容) CL 12 pF 3

CAD (KiCad official)

  • Symbol: SX2B32.000F1210F30
  • Footprint: Crystal:Crystal_SMD_2520-4Pin_2.5x2.0mm
  • 3D model: SMD2520-4P (KiCad packages3D, STEP)
  • 3D model files: sx2b32-000f1210f30-etched.step / sx2b32-000f1210f30-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sx2b32-000f1210f30.step / sx2b32-000f1210f30.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen SCTF Elec datasheet (8 pp, sha256 81c6c3c70275fa73, retrieved 2026-10-21, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF