W25Q16JVSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	Active-low SPI Chip Select input. When /CS is high the device is deselected and DO/IOx pins go to high impedance and current drops to standby. When /CS is low the device is selected and accepts instructions on DI/IOx. /CS must track VCC at power-up/down; a pull-up resistor is recommended.
2	DO (IO1)	bidirectional	Standard/Dual SPI serial data output; in Quad SPI mode (QE=1) this becomes bidirectional I/O bit 1 (IO1). Data is shifted out on the falling edge of CLK in standard SPI, or bidirectional on CLK edges for Dual/Quad I/O instructions.
3	/WP (IO2)	bidirectional	Active-low hardware Write Protect input for the Status Register (used with CMP/SEC/TB/BP2:0/SRP bits). Becomes bidirectional IO2 for Quad SPI instructions when QE=1 in Status Register-2.
4	GND	power_in	Device ground (0 V) reference.
5	DI (IO0)	bidirectional	Standard/Dual SPI serial data input; becomes bidirectional I/O bit 0 (IO0) for Dual/Quad SPI instructions. In Standard SPI, instructions/addresses/data are shifted in on the rising edge of CLK.
6	CLK	input	Serial Clock input. Provides timing for all serial input and output operations. SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1) are supported, up to 133 MHz.
7	/HOLD or /RESET (IO3)	bidirectional	Active-low /HOLD (pauses SPI transactions while /CS remains low) or optional /RESET function in Standard/Dual SPI. In Quad SPI mode (QE=1) this pin becomes bidirectional IO3 and the /HOLD/ /RESET function is not available.
8	VCC	power_in	Device power supply, 2.7 V to 3.6 V. Typical power-down current <1 uA. /CS input must track VCC during power-up and power-down.

Key specifications

Parameter	Value
Manufacturer	Winbond Elec
Package	SOIC-8-208mil
Category	Memory
Pins	8

Ordering variants

Same part, different packaging or reel option.

W25Q16JVSSIQ
W25Q16JVSSIQSSIG
W25Q16JVSSIQSN
W25Q16JVSSIQSNIQ
W25Q16JVSSIQSNIG
W25Q16JVSSIQZP
W25Q16JVSSIQZPIQ
W25Q16JVSSIQZPIG
W25Q16JVSSIQUX
W25Q16JVSSIQUXIQ
W25Q16JVSSIQUXIG
W25Q16JVSSIQUU
W25Q16JVSSIQUUIQ
W25Q16JVSSIQUUIG
W25Q16JVSSIQXG
W25Q16JVSSIQXGIQ
W25Q16JVSSIQXGIG
W25Q16JVSSIQBY

CAD (KiCad official)

Symbol: W25Q16JVSSIQ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8-208mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`w25q16jvssiq.step`	122 KB	You want the bare part, or you mark your own boards.
`w25q16jvssiq-etched.step`	2.6 MB	You want the part with `W25Q16JVSSIQ` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 616 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Winbond Elec datasheet (75 pp, sha256 ebb56256faa02967, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF