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Contents

README

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SP1003-01ETG

Littelfuse · TVS · SOD-882

SP1003-01ETG from Littelfuse, in a SOD-882. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Pin 1 is one of the two terminals of the unidirectional 30pF TVS diode (SP1003-01), rated for ±30kV IEC 61000-4-2 contact and air ESD and 7A peak pulse current (8/20µs); the text does not name this pin's function.
2 2 passive Pin 2 is the other terminal of the unidirectional 30pF TVS diode (SP1003-01), rated for ±30kV IEC 61000-4-2 contact and air ESD and 7A peak pulse current (8/20µs); the text does not name this pin's function.

Key specifications

Parameter Value
Manufacturer Littelfuse
Package SOD-882
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Voltage Drop VR 6 7.8 8.5 V IR=1mA 2
Reverse Leakage Current ILEAK 100 nA VR=5V 2
Reverse Standoff Voltage VRWM 5 V IR≤1µA 2
Clamp Voltage VC 11.4 V Ipp=6A tp=8/20µs 2
Clamp Voltage VC 12 V Ipp=7A tp=8/20µs 2
Forward Voltage Drop VF 0.8 1.2 V IF = 10mA 2
ESD Withstand Voltage (contact discharge) VESD -30 30 kV IEC61000-4-2 (Contact Discharge) 2
ESD Withstand Voltage (air discharge) VESD -30 30 kV IEC61000-4-2 (Air Discharge) 2
Peak Pulse Current IPP 7 A tp=8/20μs 2
Operating Temperature TOP -40 125 °C 2
Storage Temperature TSTOR -55 150 °C 2
Storage Temperature Range -55 150 °C 2
Maximum Junction Temperature 150 °C 2
Maximum Lead Temperature (Soldering) 260 °C Soldering 20-40s 2
Dynamic Resistance RDYN 0.25 Ω TLP, tp =100ns, I/O to GND 2
Diode Capacitance CD 30 pF Reverse Bias=0V 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper Alloy tin Lead Plating Pre-Plated Frame or Matte Tin Lead Material Copper Alloy 4

CAD (KiCad official)

  • Symbol: SP1003-01ETG
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: SOD-882 (KiCad packages3D, STEP)
  • 3D model files: sp1003-01etg-etched.step / sp1003-01etg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp1003-01etg.step / sp1003-01etg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (5 pp, sha256 6fef0fee33f8661f, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF