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BCPDQ3V3-HF
Public Made by Adomby adom
BORN ESD Protection Devices, DFN1006-2. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBCPDQ3V3-HF
BORN · ESD Protection Devices · DFN1006-2
BCPDQ3V3-HF from BORN, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Pin 1 | passive | Bidirectional ESD protection line terminal (reverse stand-off 3.3V, 80W peak pulse power 8/20μs); interchangeable with pin 2 as the device is bidirectional. |
| 2 | Pin 2 | passive | Bidirectional ESD protection line terminal (reverse stand-off 3.3V, 80W peak pulse power 8/20μs); interchangeable with pin 1 as the device is bidirectional. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VRWM | 3.3 | V | 2 | |||
| Reverse Breakdown Voltage | VBR | 3.8 | V | IT=1mA | 2 | ||
| Reverse Leakage Current | IR | 0.1 | 0.2 | μA | VRWM=3.3V,T=25℃ | 2 | |
| Peak Pulse Current | IPP | 10 | A | tp =8/20μs | 2 | ||
| Clamping Voltage 1 | VCL | 8 | V | IPP=16A,tp=100ns | 2 | ||
| Clamping Voltage 2 (5A) | VC | 6 | V | IPP=5A,tp=8/20μs | 2 | ||
| Clamping Voltage 2 (10A) | VC | 8 | V | IPP=10A,tp=8/20μs | 2 | ||
| Junction Capacitance | Cj | 12 | 18 | pF | VR = 0V, f = 1MHz | 2 | |
| Dynamic resistance | RDYN | 0.2 | Ω | 2 | |||
| Peak Pulse Power | PPP | 80 | Watts | tp =8/20μs | 2 | ||
| Peak Pulse Current | Ipp | 10 | A | tp =8/20μs | 2 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | 25 | kV | 2 | |||
| ESD per IEC 61000-4-2 (Contact) | VESD | 15 | kV | 2 | |||
| Lead Soldering Temperature | TL | 260 | ℃ | 10seconds | 2 | ||
| Junction Temperature | TJ | -55 | 125 | ℃ | 2 | ||
| Storage Temperature | Tstg | -55 | 125 | ℃ | 2 |
CAD (KiCad official)
- Symbol:
BCPDQ3V3-HF - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
bcpdq3v3-hf-etched.step/bcpdq3v3-hf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bcpdq3v3-hf.step/bcpdq3v3-hf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (4 pp, sha256
628682745d8b34f3, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).