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Contents

README

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BAT54CXV3T1G

onsemi · Schottky Diodes · SC-89-3

BAT54CXV3T1G from onsemi, in a SC-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode of one of the two Schottky diodes in this dual common-cathode device; the device is rated for 30 V reverse voltage and 200 mA maximum DC forward current.
2 ANODE passive Anode of the second Schottky diode in this dual common-cathode device; the device is rated for 30 V reverse voltage and 200 mA maximum DC forward current.
3 CATHODE passive Common cathode shared by both Schottky diodes; the device is rated for 30 V reverse voltage and 200 mA maximum DC forward current.

Key specifications

Parameter Value
Manufacturer onsemi
Package SC-89-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage V(BR)R 30 V IR = 10 A 2
Total Capacitance CT 7.6 10 pF VR = 1.0 V, f = 1.0 MHz 2
Reverse Leakage IR 0.5 2 Adc VR = 25 V 2
Forward Voltage VF 0.22 0.24 V IF = 0.1 mA 2
Forward Voltage VF 0.29 0.32 V IF = 1.0 mA 2
Forward Voltage VF 0.35 0.4 V IF = 10 mA 2
Forward Voltage VF 0.41 0.5 V IF = 30 mA 2
Forward Voltage VF 0.52 0.8 V IF = 100 mA 2
Reverse Recovery Time trr 5 ns IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc, Figure 1 2
Reverse Voltage VR 30 V 1
Forward Power Dissipation PF 240 mW @ TA = 25°C 1
Forward Power Dissipation Derating PF 1.9 mW/°C Derate above 25°C 1
Forward Current (DC) IF 200 mA 1
Non-Repetitive Peak Forward Current IFSM 600 mA tp < 10 msec 1
Repetitive Peak Forward Current IFRM 300 mA Pulse Wave = 1 sec, Duty Cycle = 66% 1
Junction Temperature TJ -55 125 °C 1
Storage Temperature Range Tstg -55 150 °C 1
Thermal Resistance, Junction-to-Ambient RJA 525 °C/W FR-4 board with minimum mounting pad (Note 1) 1

CAD (KiCad official)

  • Symbol: BAT54CXV3T1G
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SC-89-3 (KiCad packages3D, STEP)
  • 3D model files: bat54cxv3t1g-etched.step / bat54cxv3t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bat54cxv3t1g.step / bat54cxv3t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 3edab1c8c24946a4, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF