LTC7004EMSE#PBF from Analog Devices, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCC	power_in	Main supply pin; a bypass capacitor with a minimum value of 0.1µF should be tied between this pin and GND.
2	VCCUV	input	VCC undervoltage lockout set pin; a voltage of 0.5V to 1.5V on this pin is multiplied by seven to set the gate drive UVLO, shorting it to ground sets 3.5V and leaving it open sets 7.0V.
3	GND	power_in	Ground; the exposed pad must be soldered to the PCB for rated electrical and thermal performance.
4	INP	input	CMOS-compatible input referenced to GND that sets the state of TGDN and TGUP, with an internal 1MΩ pull-down to GND.
5	OVLO	input	Overvoltage lockout input; a voltage above 1.21V pulls TGDN to TS, normal operation resumes below 1.11V, and the pin should be tied to GND when not used.
6	TGDN	output	High current gate driver pull-down that pulls down to TS; tie directly to the external high side MOSFET gate for the fastest turn-off.
7	TGUP	output	High current gate driver pull-up that pulls up to BST; tie to TGDN for maximum transition speed, or use a series resistor to control turn-on inrush current.
8	TS	power_in	Top (high side) source connection, or GND if used in ground referenced applications.
9	BST	power_in	High side bootstrapped supply; an external capacitor with a minimum value of 0.1µF should be tied between this pin and TS, with voltage swing from 12V to (VTS + 12V).
10	NC	unconnected	No connect; this pin should be left floating.
11	GND	power_in	Exposed pad is GND and must be soldered to the PCB for rated electrical and thermal performance.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	MSOP-10-EP
Category	Power Management ICs
Pins	11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
TS Operating Voltage Range		0		60	V		3
Total Supply Current				225	µA	ON or Sleep, Charge Pump Regulating, VBST = OPEN, VTS = 12V	3
VCC Supply Current, Charge Pump Overdriven, ON Mode			27	50	µA	VBST-TS = 13V, VINP = 4V	3
VCC Supply Current, Charge Pump Overdriven, Sleep Mode			27	50	µA	VBST-TS = 13V, VINP = 0.4V	3
VCC Undervoltage Lockout, VCC Rising		6.5	7	7.5	V	VCCUV = OPEN	3
VCC Undervoltage Lockout, VCC Falling		5.8	6.4	6.9	V	VCCUV = OPEN	3
VCC Undervoltage Lockout, VCC Rising		3.1	3.5	3.7	V	VCCUV = 0V	3
VCC Undervoltage Lockout, VCC Falling		2.8	3.2	3.4	V	VCCUV = 0V	3
VCC Undervoltage Lockout, VCC Rising		9.7	10.5	10.9	V	VCCUV = 1.5V	3
VCC Undervoltage Lockout, VCC Falling		9.1	9.9	10.3	V	VCCUV = 1.5V	3
VBST-TS (VTG above VTS, INP = 3V)	VBST-TS	9	10	10	V	VCC = VTS = 7V, IBST = 0µA	3
VBST-TS (VTG above VTS, INP = 3V)	VBST-TS	11	12	12	V	VCC = VTS = 10V, IBST = 0µA	3
VBST-TS (VTG above VTS, INP = 3V)	VBST-TS	14	14	14	V	VTS = 60V, IBST = 0µA	3
Charge Pump Output Current		-15	-30		µA	VTS = 20V, VBST-TS = 10V	3
TG Pull-Up Resistance			2.2	7	Ω	VCC = VBST = 12V	3
TG Pull-Down Resistance			1	4	Ω	VCC = VBST = 12V	3
Input to Output Propagation Delay, VINP Rising	tPLH		35	70	ns	VINP Rising, CL = 1nF	3
Input to Output Propagation Delay, VINP Falling	tPHL		35	70	ns	VINP Falling, CL = 1nF	3
Input Threshold Voltage, VINP Rising	VIH	1.7	2	2.2	V	VINP Rising	3
Input Threshold Voltage, VINP Falling	VIL	1.3	1.6	1.8	V	VINP Falling	3
Input Pull-Down Resistance			1		MΩ	VINP = 1V	3
OVLO Pin Threshold Voltage, Rising		1.16	1.21	1.26	V	Rising	3
OVLO Pin Threshold Voltage, Falling		1.05	1.1	1.15	V	Falling	3
OVLO Pin Leakage Current		-100	0	100	nA	VOVLO = 1.3V	3
VCCUV Pull-Up Current	VVCCUV	-11.3	-10	8.7	µA	VVCCUV = 1V	3
TS Voltage	TS	-6		65	V		2
BST-TS Voltage	BST-TS	-0.3		15	V		2
VCC Voltage	VCC	-0.3		15	V		2
BST Voltage	BST	-0.3		80	V		2
INP Voltage	INP	-6		15	V		2
VCCUV Voltage	VCCUV	-0.3		6	V		2
OVLO Voltage	OVLO	-0.3		6	V		2
Operating Junction Temperature Range	TJ	-40		125	°C	LTC7004E	2
Storage Temperature Range	TSTG	-65		150	°C		2
Lead Temperature (Soldering, 10 sec), MSOP Package				300	°C	10 sec soldering	2
Maximum Junction Temperature	TJMAX			150	°C		2
Junction-to-Ambient Thermal Resistance	θJA		45		°C/W		2
Junction-to-Case Thermal Resistance	θJC		10		°C/W		2

CAD (KiCad official)

Symbol: LTC7004EMSE#PBF
Footprint: Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
3D model: MSOP-10-EP (KiCad packages3D, STEP)
3D model files: ltc7004emse-pbf-etched.step / ltc7004emse-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ltc7004emse-pbf.step / ltc7004emse-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (18 pp, sha256 e91bace7fe2963e2, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

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