component
mSMD050-24V
Public Made by Adomby adom
TECHFUSE Resettable Fuses, 1812. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownmSMD050-24V
TECHFUSE · Resettable Fuses · 1812
mSMD050-24V from TECHFUSE, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (Vmax) | Vmax | 24 | Vdc | Maximum operating voltage at rated current (Imax) | 2 | ||
| Maximum fault current (Imax) | Imax | 100 | A | Maximum fault current at rated voltage (Vmax) | 2 | ||
| Hold current (Ihold) | Ihold | 0.5 | A | Maximum current device will not trip, 25°C still air | 2 | ||
| Trip current (Itrip) | Itrip | 1 | A | Minimum current at which device will always trip, 25°C still air | 2 | ||
| Power dissipation in tripped state (Pd) | Pd | 0.8 | W | Tripped state, 25°C still air, at rated voltage | 2 | ||
| Minimum device resistance prior to tripping (Rimin) | Rimin | 0.15 | 25°C, prior to tripping | 2 | |||
| Maximum surface temperature in tripped state | 125 | °C | Device in tripped state | 2 | |||
| Ambient operating temperature | -40 | 85 | °C | Ambient operating conditions | 2 | ||
| Storage temperature | 40 | °C | Storage conditions; 70% R.H. max | 4 | |||
| Maximum recommended solder paste thickness | 0.25 | mm | Recommended maximum paste thickness for reflow | 4 |
CAD (KiCad official)
- Symbol:
mSMD050-24V - Footprint:
Fuse:Fuse_1812_4532Metric - 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
msmd050-24v-etched.step/msmd050-24v-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);msmd050-24v.step/msmd050-24v.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TECHFUSE datasheet (4 pp, sha256
763fb24e1dcbf9b7, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).