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HGV8551MM
Public Made by Adomby adom
HGSEMI Operational Amplifier, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHGV8551MM
HGSEMI · Operational Amplifier · MSOP-8
HGV8551MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connect; not internally connected per the HGV8551 SOP-8/MSOP-8 pin diagram. |
| 2 | INA- | input | Inverting input of the amplifier; input voltage range limited to VSS-0.5V to VDD+0.5V absolute maximum (VSS-0.1V to VDD+0.1V common-mode in normal operation). |
| 3 | INA+ | input | Non-inverting input of the amplifier; input voltage range limited to VSS-0.5V to VDD+0.5V absolute maximum (VSS-0.1V to VDD+0.1V common-mode in normal operation). |
| 4 | VSS | power_in | Negative supply or ground; for dual-supply operation (±0.9V to ±2.75V) bypass with a 0.1µF ceramic capacitor. |
| 5 | NC | unconnected | No connect; not internally connected per the HGV8551 SOP-8/MSOP-8 pin diagram. |
| 6 | OUT | output | Rail-to-rail amplifier output with about 65mA output current and 60mA short-circuit limit. |
| 7 | VDD | power_in | Positive supply, 1.8V to 5.5V single-supply (7.5V absolute maximum); place a 0.1µF ceramic bypass capacitor close to the pin. |
| 8 | NC | unconnected | No connect; not internally connected per the HGV8551 SOP-8/MSOP-8 pin diagram. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Supply Voltage (VDD to Vss) | VDD | -0.5 | 7.5 | V | VDD to Vss | 3 | |
| PDB Input Voltage | 7 | V | Min printed as Vss-0.5V (expression, not numeric) | 3 | |||
| Operating Temperature Range | TA | -40 | 85 | °C | 3 | ||
| Junction Temperature | TJ | 160 | °C | 3 | |||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 3 | ||
| Lead Temperature | 260 | °C | soldering, 10sec | 3 | |||
| ESD Susceptibility HBM | 6 | KV | HBM | 3 | |||
| ESD Susceptibility MM | 400 | V | MM | 3 | |||
| Single-Supply Operating Voltage | VS | 1.8 | 5.5 | V | Single-supply operation, from Features and Application Note (no operating-conditions table) | 1 | |
| Input Offset Voltage | VOS | 1 | 30 | µV | 4 | ||
| Input Offset Voltage Drift | ΔVOS/ΔT | 10 | 50 | nV/℃ | 4 | ||
| Input Bias Current | IB | 20 | pA | 4 | |||
| Input Offset Current | IOS | 10 | pA | 4 | |||
| Common-Mode Rejection Ratio | CMRR | 110 | dB | VCM = 0V to 5V | 4 | ||
| Large Signal Voltage Gain | AVO | 145 | dB | RL = 10kΩ, VO = 0.3V to 4.7V | 4 | ||
| Output Voltage High | VOH | 4.998 | V | RL = 100kΩ to - VS | 4 | ||
| Output Voltage High | VOH | 4.994 | V | RL = 10kΩ to - VS | 4 | ||
| Output Voltage Low | VOL | 2 | mV | RL = 100kΩ to + VS | 4 | ||
| Output Voltage Low | VOL | 5 | mV | RL = 10kΩ to + VS | 4 | ||
| Short Circuit Limit | ISC | 60 | mA | RL =10Ω to - VS | 4 | ||
| Output Current | IO | 65 | mA | 4 | |||
| Power Supply Rejection Ratio | PSRR | 115 | dB | VS = 2.5V to 5.5V | 4 | ||
| Quiescent Current | IQ | 180 | µA | VO = 0V, RL = 0Ω | 4 | ||
| Gain-Bandwidth Product | GBP | 1.8 | MHz | G = +100 | 4 | ||
| Slew Rate | SR | 0.95 | V/µs | RL = 10kΩ | 4 | ||
| Overload Recovery Time | 0.1 | ms | 4 | ||||
| Voltage Noise (en p-p) | en p-p | 0.3 | µVP-P | 0Hz to 10Hz | 4 | ||
| Voltage Noise Density | en | 38 | nV Hz | f = 1kHz | 4 | ||
| Package Thermal Resistance, junction-to-ambient (MSOP-8) | θJA | 216 | °C/W | TA=+25℃ | 3 |
CAD (KiCad official)
- Symbol:
HGV8551MM - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
hgv8551mm-etched.step/hgv8551mm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgv8551mm.step/hgv8551mm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (14 pp, sha256
5fbbb583df3651ad, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).