component
VB4610N
Public Made by Adomby adom
VBsemi Elec MOSFETs, TSOP-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownVB4610N
VBsemi Elec · MOSFETs · TSOP-6
VB4610N from VBsemi Elec, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G1 | input | Gate of P-channel MOSFET 1, with gate-source voltage limited to ±20 V. |
| 2 | S2 | passive | Source of P-channel MOSFET 2; drain-source voltage rated -60 V. |
| 3 | G2 | input | Gate of P-channel MOSFET 2, with gate-source voltage limited to ±20 V. |
| 4 | D2 | passive | Drain of P-channel MOSFET 2; drain-source voltage -60 V, continuous drain current -4.5 A at TC = 25 °C. |
| 5 | S1 | passive | Source of P-channel MOSFET 1; drain-source voltage rated -60 V. |
| 6 | D1 | passive | Drain of P-channel MOSFET 1; drain-source voltage -60 V, continuous drain current -4.5 A at TC = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TSOP-6 |
| Category | Transistors/Thyristors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -60 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | -4.5 | A | TJ = 150 °C; TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | -4 | A | TJ = 150 °C; TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | -3.5 | A | TJ = 150 °C; TA = 25 °C; notes a, b | 1 | ||
| Continuous Drain Current | ID | -3 | A | TJ = 150 °C; TA = 70 °C; notes a, b | 1 | ||
| Pulsed Drain Current | IDM | -20 | A | t = 100 μs | 1 | ||
| Continuous Source-Drain Diode Current | IS | -3.9 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | -2.1 | A | TA = 25 °C; notes a, b | 1 | ||
| Avalanche Current | IAS | -15 | A | L = 0.1 mH | 1 | ||
| Single-Pulse Avalanche Energy | EAS | 11.25 | mJ | 1 | |||
| Maximum Power Dissipation | PD | 4.2 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 2.7 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 2 | W | TA = 25 °C; notes a, b | 1 | ||
| Maximum Power Dissipation | PD | 1.3 | W | TA = 70 °C; notes a, b | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum junction-to-ambient | RthJA | 100 | 130 | °C/W | t ≤ 5 s; surface mounted (note a) | 1 | |
| Maximum junction-to-ambient, steady state | RthJA | 110 | °C/W | steady state; note c | 1 | ||
| Maximum junction-to-case (drain) | RthJF | 60 | 75 | °C/W | steady state | 1 | |
| Drain-Source Breakdown Voltage | VDS | -60 | V | VGS = 0 V, ID = -250 μA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | -1 | -3 | V | VDS = VGS, ID = -250 μA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | -1 | μA | VDS = -60 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -5 | μA | VDS = -60 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | -30 | A | VDS ≥ -10 V, VGS = -10 V | 2 | ||
| Total Gate Charge | Qg | 20 | 30 | nC | VDS = -30 V, VGS = -10 V, ID = -3.5 A | 2 | |
| Total Gate Charge | Qg | 10.1 | 15.2 | nC | VDS = -30 V, VGS = -4.5 V, ID = -3.5 A | 2 | |
| Gate Resistance | Rg | 1.8 | 9 | 18 | Ω | f = 1 MHz | 2 |
| Turn-On Delay Time | td(on) | 8 | 16 | ns | VDD = -30 V, RL = 10.7 Ω, ID ≅ -2.8 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 6 | 12 | ns | VDD = -30 V, RL = 10.7 Ω, ID ≅ -2.8 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 35 | 53 | ns | VDD = -30 V, RL = 10.7 Ω, ID ≅ -2.8 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 16 | 24 | ns | VDD = -30 V, RL = 10.7 Ω, ID ≅ -2.8 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Turn-On Delay Time | td(on) | 40 | 60 | ns | VDD = -30 V, RL = 10.7 Ω, ID ≅ -2.8 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 28 | 42 | ns | VDD = -30 V, RL = 10.7 Ω, ID ≅ -2.8 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 31 | 47 | ns | VDD = -30 V, RL = 10.7 Ω, ID ≅ -2.8 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 15 | 23 | ns | VDD = -30 V, RL = 10.7 Ω, ID ≅ -2.8 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Continous Source-Drain Diode Current | IS | -3.5 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | -20 | A | t = 100 μs | 2 | ||
| Body Diode Voltage | VSD | -0.85 | -1.2 | V | IS = -2.8 A, VGS = 0 V | 2 | |
| Body Diode Reverse Recovery Time | trr | 32 | 48 | ns | IF = -2.8 A, dI/dt = 100 A/μs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 45 | 68 | nC | IF = -2.8 A, dI/dt = 100 A/μs, TJ = 25 °C | 2 |
CAD (KiCad official)
- Symbol:
VB4610N - Footprint:
Package_SO:TSOP-6_1.65x3.05mm_P0.95mm - 3D model: TSOP-6 (KiCad packages3D, STEP)
- 3D model files:
vb4610n-etched.step/vb4610n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);vb4610n.step/vb4610n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (9 pp, sha256
c61f9a42f49ccdd0, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).