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abs6-12
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Shandong Jingdao Microelectronics Bridge Rectifiers, ABS. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Contents
README
markdownABS6-12
Shandong Jingdao Microelectronics · Bridge Rectifiers · ABS
ABS6-12 from Shandong Jingdao Microelectronics, in a ABS. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | - | passive | Bridge rectifier DC output cathode (-) terminal. |
| 2 | + | passive | Bridge rectifier DC output anode (+) terminal. |
| 3 | Input Pin (~) | passive | AC input terminal of the bridge rectifier. |
| 4 | Input Pin (~) | passive | AC input terminal of the bridge rectifier. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | ABS |
| Category | Diodes |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM | 600 | V | 1 | |||
| Maximum RMS Voltage | VRMS | 420 | V | 1 | |||
| Maximum DC Blocking Voltage | VDC | 600 | V | 1 | |||
| Average Rectified Output Current | IO | 1.2 | A | at Tc = 125 °C | 1 | ||
| Peak Forward Surge Current | IFSM | 40 | A | 8.3 ms single half sine wave superimposed on rated load (JEDEC method) | 1 | ||
| Forward Voltage per element | VF | 1.1 | V | IF = 1.2A | 1 | ||
| Maximum DC Reverse Current | IR | 5 | μA | at rated DC blocking voltage, TA=25 °C | 1 | ||
| Maximum DC Reverse Current | IR | 100 | μA | at rated DC blocking voltage, TA=125 °C | 1 | ||
| Operating and Storage Temperature Range | Tj, Tstg | -55 | 150 | °C | 1 | ||
| Typical Junction Capacitance | Cj | 18 | pF | Measured at 1MHz and applied reverse voltage of 4 V D.C. | 1 | ||
| Typical Thermal Resistance | RθJA | 70 | °C/W | Mounted on glass epoxy PC board with 4×1.5"×1.5" copper pad | 1 | ||
| Typical Thermal Resistance | RθJC | 18 | °C/W | Mounted on glass epoxy PC board with 4×1.5"×1.5" copper pad | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | ABS | Plastic surface mounted package; 4 leads ABS/LBF | 3 |
CAD (KiCad official)
- Symbol:
ABS6-12 - Footprint:
Diode_SMD:Diode_Bridge_Diotec_ABS - 3D model: ABS (KiCad packages3D, STEP)
- 3D model files:
abs6-12-etched.step/abs6-12-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);abs6-12.step/abs6-12.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256
a3bdd06d3b8e5257, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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