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Contents

README

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NCEP080N10

Wuxi NCE Power Semiconductor · MOSFETs · TO-220

NCEP080N10 from Wuxi NCE Power Semiconductor, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; the datasheet gives a maximum gate-source voltage of ±20 V, threshold VGS(th) 2.0 to 4.0 V at VDS=VGS, ID=250 µA.
2 D passive Drain; rated for VDS 100 V, continuous ID 75 A (58 A at TC=100 °C) and pulsed IDM 300 A, and also connected to the tab.
3 S passive Source; the datasheet gives body-diode continuous forward current IS of 75 A max.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package TO-220
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=100V,VGS=0V 2
Gate-Body Leakage Current IGSS 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 2 3 4 V VDS=VGS, ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 7.4 8 mΩ VGS=10V, ID=37.5A 2
Forward Transconductance gFS 60 S VDS=5V,ID=37.5A 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=37.5A 2
Diode Forward Current IS 75 A 2
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 75 A 1
Drain Current-Continuous (TC=100℃) ID(100℃) 58 A TC=100℃ 1
Pulsed Drain Current IDM 300 A 1
Maximum Power Dissipation PD 120 W 1
Derating factor 0.8 W/℃ 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Thermal Resistance, Junction-to-Case RθJC 1.25 ℃/W 1

CAD (KiCad official)

  • Symbol: NCEP080N10
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: ncep080n10-etched.step / ncep080n10-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncep080n10.step / ncep080n10.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (6 pp, sha256 4c52a1a6e83ec6a7, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF