Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

PNE20040EPEZ

Nexperia · Switching Diodes · TO-277

PNE20040EPEZ from Nexperia, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode 1 of the dual-anode hyperfast rectifier; the datasheet gives no pin-specific limit, so the device limits apply (VRRM 200 V, IF(AV) 4 A).
2 A2 passive Anode 2 of the dual-anode hyperfast rectifier; the datasheet gives no pin-specific limit, so the device limits apply (VRRM 200 V, IF(AV) 4 A).
3 K passive Common cathode, which is the cathode tab used as the soldering point for the junction-to-solder-point thermal resistance Rth(j-sp) of 1.2 K/W maximum.

Key specifications

Parameter Value
Manufacturer Nexperia
Package TO-277
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse voltage VR 200 V 2
Repetitive peak reverse voltage VRRM 200 V 2
Limiting RMS reverse voltage VR(RMS)lim 140 V Tj = 25 °C 2
Forward current IF 5.6 A δ = 1; Tsp ≤ 150 °C 2
Average forward current IF(AV) 4 A δ = 0.5; f = 20 kHz; square wave; Tsp ≤ 173 °C 2
Non-repetitive peak forward current IFSM 130 A tp = 8.3 ms; single half sine wave (applied at rated load condition); Tj(init) = 25 °C 2
Total power dissipation Ptot 1.75 W Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, standard footprint (note [1]) 2
Total power dissipation Ptot 2.15 W FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 (note [2]) 2
Junction temperature Tj 175 °C 2
Ambient temperature Tamb -55 175 °C 2
Storage temperature Tstg -65 175 °C 2
Thermal resistance from junction to ambient in free air Rth(j-a) 85 K/W FR4 PCB, single-sided copper, tin-plated, standard footprint (note [1]) 3
Thermal resistance from junction to ambient in free air Rth(j-a) 70 K/W FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 (note [2]) 3
Thermal resistance from junction to solder point Rth(j-sp) 1.2 K/W Soldering point of cathode tab (note [3]) 3
Reverse breakdown voltage V(BR)R 200 V IR = 100 µA; Tj = 25 °C 4
Forward voltage VF 860 930 mV IF = 4 A; Tj = 25 °C 4
Forward voltage VF 710 780 mV IF = 4 A; Tj = 125 °C 4
Reverse current IR 1 µA VR = 200 V; Tj = 25 °C 4
Reverse current IR 1.5 10 µA VR = 200 V; Tj = 125 °C 4
Reverse recovery time, step recovery trr 12 30 ns IF = 0.5 A; IR = 1 A; IR(meas) = 0.25 A; Tj = 25 °C 4

CAD (KiCad official)

  • Symbol: PNE20040EPEZ
  • Footprint: Package_TO_SOT_SMD:TO-277A
  • 3D model: TO-277 (KiCad packages3D, STEP)
  • 3D model files: pne20040epez-etched.step / pne20040epez-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pne20040epez.step / pne20040epez.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 adec488be708105a, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF