component
ADS7950SBRGET
Public Made by Adomby adom
Texas Instruments Analog To Digital Converters (ADC), VQFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Contents
README
markdownADS7950SBRGET
Texas Instruments · Analog To Digital Converters (ADC) · VQFN-24-EP(4x4)
ADS7950SBRGET from Texas Instruments, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | +VA | power_in | Analog power supply, 2.7 V to 5.25 V recommended, with a 1-µF ceramic decoupling capacitor required at each supply pin. |
| 2 | AGND | power_in | Analog ground; all channel inputs share this common analog ground. |
| 3 | MXO | output | Multiplexer output, which may be shorted to AINP or routed through a buffer or signal-conditioning stage, with source impedance kept to 50 Ω or less when shorted directly. |
| 4 | AINP | input | ADC input signal, with AINP to AGND limited to -0.3 V to +VA + 0.3 V as an absolute maximum. |
| 5 | AINM | input | ADC input ground, the negative reference for the ADC input. |
| 6 | NC | unconnected | Internally not connected; do not float this pin and connect it to ground. |
| 7 | NC | unconnected | Internally not connected; do not float this pin and connect it to ground. |
| 8 | CH3 | input | Analog input channel 3 for the multiplexer, with CHn to AGND limited to -0.3 V to +VA + 0.3 V. |
| 9 | CH2 | input | Analog input channel 2 for the multiplexer, with CHn to AGND limited to -0.3 V to +VA + 0.3 V. |
| 10 | CH1 | input | Analog input channel 1 for the multiplexer, with CHn to AGND limited to -0.3 V to +VA + 0.3 V. |
| 11 | CH0 | input | Analog input channel 0 for the multiplexer, with CHn to AGND limited to -0.3 V to +VA + 0.3 V. |
| 12 | NC | unconnected | Internally not connected; do not float this pin and connect it to ground. |
| 13 | NC | unconnected | Internally not connected; do not float this pin and connect it to ground. |
| 14 | +VA | power_in | Analog power supply, 2.7 V to 5.25 V recommended, with a 1-µF ceramic decoupling capacitor required at each supply pin. |
| 15 | AGND | power_in | Analog ground; all channel inputs share this common analog ground. |
| 16 | CS | input | Active-low chip-select input; the input signal is sampled on its falling edge and a frame ends only after 16 SCLK clocks have elapsed. |
| 17 | SCLK | input | Serial clock input, up to 20 MHz, used for conversion, serial data output and serial data input. |
| 18 | SDI | input | Serial data input for the 16-bit control word, latched on each SCLK rising edge starting with the first clock. |
| 19 | SDO | output | Serial data output carrying the channel address and conversion result, which goes to the 3-state condition after the 16th SCLK falling edge. |
| 20 | BDGND | power_in | Digital ground for the digital I/O interface. |
| 21 | +VBD | power_in | Digital I/O supply, 1.7 V to +VA recommended, with a 1-µF ceramic decoupling capacitor required at the pin. |
| 22 | GPIO0 | bidirectional | General-purpose input or output; when configured it serves as an active-high high- or low-alarm output on the VQFN package. |
| 23 | REFM | input | Reference ground for the external 2.5 V reference, which needs a 10-µF ceramic decoupling capacitor to REFP placed next to the device. |
| 24 | REFP | input | External reference input, 2 V to 3 V recommended (2.5 V nominal, ±10 mV), requiring a 10-µF ceramic decoupling capacitor to REFM. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-24-EP(4x4) |
| Category | Data Acquisition |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Full-scale input span | 0 | V | Range 1 | 12 | |||
| Absolute input range | -0.2 | V | Range 1 | 12 | |||
| Integral linearity | -1 | 0.5 | 1 | LSB | ADS795XSB | 12 | |
| Differential linearity | -0.99 | 0.5 | 1 | LSB | ADS795XSB | 12 | |
| Offset error | -3.5 | 1.1 | 3.5 | LSB | 12 | ||
| Gain error | -2 | 0.2 | 2 | LSB | Range 1 | 12 | |
| Gain error | -0.2 | 0.2 | LSB | Range 2 | 12 | ||
| Total unadjusted error (TUE) | -2 | 2 | LSB | 12 | |||
| Signal-to-noise ratio | 70 | 71.7 | dB | 100 kHz, ADS795XSB | 13 | ||
| Signal-to-noise + distortion | 69 | 71.3 | dB | 100 kHz, ADS795XSB | 13 | ||
| VREF reference voltage at REFP | VREF | 2 | 2.5 | 3 | V | 13 | |
| High threshold range | 0 | 4092 | LSB | 13 | |||
| Low threshold range | 0 | 4092 | LSB | 13 | |||
| Low-level input voltage | VIL | 0.8 | V | +VBD = 5 V | 13 | ||
| Low-level input voltage | VIL | 0.4 | V | +VBD = 3 V | 13 | ||
| Low-level output voltage | VOL | 0.4 | V | At Isink = 200 μA | 13 | ||
| +VA supply voltage | 2.7 | 3.3 | 5.25 | V | 13 | ||
| +VBD supply voltage | 1.7 | 3.3 | 5.25 | V | 13 | ||
| Supply current (normal mode), 1 MHz throughput | 2.3 | 3 | mA | At +VA = 4.7 to 5.25 V | 13 | ||
| Supply current (normal mode), static state | 1.1 | 1.5 | mA | At +VA = 4.7 to 5.25 V | 13 | ||
| Analog power-supply voltage | V(+VA) | 2.7 | 3.3 | 5.25 | V | 10 | |
| Digital I/O-supply voltage | V(+VBD) | 1.7 | 3.3 | V | 10 | ||
| Reference voltage | V(REF) | 2 | 2.5 | 3 | V | 10 | |
| SCLK frequency | ƒ(SCLK) | 20 | MHz | 10 | |||
| Operating temperature range | TA | -40 | 125 | °C | 10 | ||
| AINP or CHn to AGND | -0.3 | V | 10 | ||||
| +VA to AGND, +VBD to BDGND | -0.3 | 7 | V | 10 | |||
| Digital input voltage to BDGND | -0.3 | 7 | V | 10 | |||
| Digital output to BDGND | -0.3 | V | 10 | ||||
| Input current to any pin except supply pins | -10 | 10 | mA | 10 | |||
| Operating temperature | -40 | 125 | °C | 10 | |||
| Junction temperature (TJ Max) | 150 | °C | 10 | ||||
| Storage temperature (Tstg) | -65 | 150 | °C | 10 | |||
| Input capacitance | 15 | pF | 12 | ||||
| Input leakage current | 61 | nA | TA = 125°C | 12 | |||
| Resolution | 12 | Bits | 12 | ||||
| No missing codes | 12 | Bits | ADS795XSB | 12 | |||
| Conversion time | 800 | ns | 20 MHz SCLK | 12 | |||
| Acquisition time | 325 | ns | 12 | ||||
| Maximum throughput rate | 1 | MHz | 20 MHz SCLK | 12 | |||
| Step response | 150 | ns | 12 | ||||
| Total harmonic distortion | -82 | dB | 100 kHz | 13 | |||
| Spurious free dynamic range | 84 | dB | 100 kHz | 13 | |||
| Small signal bandwidth | 47 | MHz | At -3 dB | 13 | |||
| Channel-to-channel crosstalk (isolation) | -95 | dB | Any off-channel with 100 kHz, full-scale input to channel being sampled with DC input | 13 | |||
| Channel-to-channel crosstalk (memory) | -85 | dB | From previously sampled to channel with 100 kHz, full-scale input to channel being sampled with DC input | 13 | |||
| Reference input resistance | 100 | kΩ | At fsample = 1 MHz | 13 | |||
| Supply current (normal mode), 1 MHz throughput | 1.8 | mA | At +VA = 2.7 to 3.6 V | 13 | |||
| Supply current (normal mode), static state | 1.05 | mA | At +VA = 2.7 to 3.6 V | 13 | |||
| Power-down state supply current | 1 | μA | 13 | ||||
| +VBD supply current | 1 | mA | +VA = 5.25 V, fs = 1 MHz | 13 | |||
| Junction-to-ambient thermal resistance | RθJA | 36.9 | °C/W | RGE (VQFN) 24 pins | 11 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 39.3 | °C/W | RGE (VQFN) 24 pins | 11 | ||
| Junction-to-board thermal resistance | RθJB | 14.7 | °C/W | RGE (VQFN) 24 pins | 11 | ||
| Junction-to-top characterization parameter | ψJT | 0.7 | °C/W | RGE (VQFN) 24 pins | 11 | ||
| Junction-to-board characterization parameter | ψJB | 14.8 | °C/W | RGE (VQFN) 24 pins | 11 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 5.6 | °C/W | RGE (VQFN) 24 pins | 11 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | • A copper fill area underneath the device ties the AGND, BDGND, AINM, and REFM pins together. This | 52 |
CAD (KiCad official)
- Symbol:
ADS7950SBRGET - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
ads7950sbrget-etched.step/ads7950sbrget-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ads7950sbrget.step/ads7950sbrget.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (87 pp, sha256
e7922065e4d1691d, retrieved 2026-11-11, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).