component
FH8808G2
Public Made by Adomby adom
鑫飞宏 , DFN-6L(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFH8808G2
鑫飞宏 · IC · DFN-6L(2x3)
FH8808G2 from 鑫飞宏, in a DFN-6L(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of MOSFET 1 (pin 1, marked by the dot/'1' on the package); N-channel, VDS max 20V, ID 9.5A at TA=25°C. |
| 2 | S1 | passive | Source of MOSFET 1, second source pad; N-channel, VDS max 20V, ID 9.5A at TA=25°C. |
| 3 | G1 | input | Gate of MOSFET 1 with ESD protection; gate-source voltage limit ±12V. |
| 4 | G2 | input | Gate of MOSFET 2 with ESD protection; gate-source voltage limit ±12V. |
| 5 | S2 | passive | Source of MOSFET 2; N-channel, VDS max 20V, ID 9.5A at TA=25°C. |
| 6 | S2 | passive | Source of MOSFET 2, second source pad; N-channel, VDS max 20V, ID 9.5A at TA=25°C. |
| 7 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 鑫飞宏 |
| Package | DFN-6L(2x3) |
| Category | |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 20 | V | VGS=0V, ID=250uA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | uA | VDS=18V, VGS=0V | 2 | ||
| Gate-Body Leakage Current | IGSS | -10 | 10 | uA | VGS=±10V, VDS=0V | 2 | |
| Gate Threshold Voltage | VGS(th) | 0.5 | 0.85 | 1.5 | V | VDS=VGS, ID=1.0mA | 2 |
| Drain-Source On-State Resistance | RDS(ON) | 9 | 10.2 | mΩ | VGS=4.0V, ID=2.4A | 2 | |
| Drain-Source On-State Resistance | RDS(ON) | 10 | 11.2 | mΩ | VGS=3.0V, ID=2.4A | 2 | |
| Drain-Source On-State Resistance | RDS(ON) | 11.5 | 12.7 | mΩ | VGS=2.5V, ID=2.4A | 2 | |
| Diode Forward Voltage | VSD | 0.84 | 1.2 | V | VGS=0V, IS=9.5A | 2 | |
| Drain-Source Voltage | VDS | 20 | V | 1 | |||
| Gate-Source Voltage | VGS | -12 | 12 | V | 1 | ||
| Drain Current-Continuous | ID | 9.5 | A | TA=25°C | 1 | ||
| Drain Current-Continuous | ID | 7.6 | A | TA=70°C | 1 | ||
| Drain Current-Pulsed | IDM | 60 | A | Pulsed, pulse width <10us, duty cycle <1% (note a) | 1 | ||
| Maximum Power Dissipation | PD | 1.56 | W | TA=25°C | 1 | ||
| Maximum Power Dissipation | PD | 1 | W | TA=70°C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ TSTG | -55 | 150 | °C | 1 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 80 | °C/W | 1 |
CAD (KiCad official)
- Symbol:
FH8808G2 - Footprint:
Package_DFN_QFN:DFN-6-1EP_3x2mm_P0.5mm_EP1.65x1.35mm - 3D model: DFN-6L(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
fh8808g2-etched.step/fh8808g2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fh8808g2.step/fh8808g2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: 鑫飞宏 datasheet (6 pp, sha256
3fc6596a44d603d6, retrieved 2026-11-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).