component
BD9329EFJ-E2
Public Made by Adomby adom
ROHM Semicon DC-DC Converters, HTSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBD9329EFJ-E2
ROHM Semicon · DC-DC Converters · HTSOP-8-EP
BD9329EFJ-E2 from ROHM Semicon, in a HTSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BST | input | High-side gate drive boost input, rated at VSW + 7 V maximum, and an R_BS resistor is used to protect against VIN-BST short destruction. |
| 2 | VIN | power_in | Power input with a 4.2 V to 18.0 V operating range (12 V typical) and a 20 V absolute maximum rating, with UVLO at 3.75 V typical on rising VIN. |
| 3 | SW | output | Power switching output driving the inductor, with SW voltage of -0.5 V to 18 V in operation, 20 V absolute maximum, and a switch current limit of 3.5 A minimum. |
| 4 | GND | power_in | Ground reference that must be kept at a minimum potential in all operating conditions, and the exposed thermal pad is to be shorted to it. |
| 5 | FB | input | Feedback input regulated to 0.9 V typical (±1.5% at room temperature, ±2.0% from -25 °C to 85 °C), with an input bias current of 0.02 µA typical. |
| 6 | COMP | passive | Compensation node of the error amplifier, whose voltage is limited by the SS pin voltage during startup. |
| 7 | EN | input | Enable input with a 1.0 V to 1.4 V threshold (1.2 V typical) and a 20 V absolute maximum rating; leaving it open shuts the IC down. |
| 8 | SS | input | Soft-start control input where the soft-start time is TSS = 2.2 × CSS / ISS with ISS of 10 µA typical, giving 22 ms for CSS = 0.1 µF. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | HTSOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| FB input bias current | IFB | 0.02 | 2 | µA | 2 | ||
| Feedback voltage1 | VFB1 | 0.886 | 0.9 | 0.914 | V | Voltage follower | 2 |
| Feedback voltage2 | VFB2 | 0.882 | 0.9 | 0.918 | V | Ta=-25℃～85℃ | 2 |
| Hi/Lo-side FET Leak current | ILEAKN | 0 | 10 | µA | VIN= 18V, VSW = 0V / 18V | 2 | |
| Switch Current Limit | ILIMIT3 | 3.5 | A | 2 | |||
| Enable Sink current | IEN | 90 | 180 | 270 | µA | VEN= 12V | 2 |
| Enable Threshold voltage | VEN | 1 | 1.2 | 1.4 | V | 2 | |
| Under Voltage Lockout threshold | VUVLO | 3.5 | 3.75 | 4 | V | VIN rising | 2 |
| Soft Start Current | ISS | 5 | 10 | 15 | µA | VSS= 0 V | 2 |
| Operating Frequency | FOSC | 300 | 380 | 460 | kHz | 2 | |
| Circuit Current | ICC | 1.2 | 3 | mA | VFB= 1.5V, VEN= 12V | 2 | |
| Quiescent Current | IQUI | 15 | 27 | µA | VEN= 0V | 2 | |
| Supply Voltage (operating) | VIN | 4.2 | 12 | 18 | V | 2 | |
| SW Voltage (operating) | VSW | -0.5 | 18 | V | 2 | ||
| Output current | ISW3 | 3 | A | 2 | |||
| Output voltage range | VRANGE | 0.9 | V | 2 | |||
| Supply Voltage (absolute maximum) | VIN | 20 | V | 1 | |||
| Switch Voltage (absolute maximum) | VSW | 20 | V | 1 | |||
| EN Voltage (absolute maximum) | VEN | 20 | V | 1 | |||
| All other pins voltage (absolute maximum) | VOTH | 20 | V | 1 | |||
| Power Dissipation for HTSOP-J8 | Pd | 3760 | mW | Mount on 4-layer 70.0mm×70.0mm×1.6mm board; derate 30.08 mW/℃ above Ta≥25℃ | 1 | ||
| Operating Temperature Range | Topr | -40 | 85 | ℃ | 1 | ||
| Storage Temperature Range | Tstg | -55 | 150 | ℃ | 1 | ||
| Junction Temperature | Tjmax | 150 | ℃ | 1 | |||
| Package thermal resistance junction-to-ambient | θja | 29.27 | ℃/W | Mount on 4-layer 50mm x 30mm x 1.6mm application board | 1 | ||
| Package thermal resistance junction-to-case | θjc | 3.75 | ℃/W | Mount on 4-layer 50mm x 30mm x 1.6mm application board | 1 |
CAD (KiCad official)
- Symbol:
BD9329EFJ-E2 - Footprint:
Package_SO:HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm - 3D model: HTSOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
bd9329efj-e2-etched.step/bd9329efj-e2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bd9329efj-e2.step/bd9329efj-e2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (18 pp, sha256
85a15b87e8976378, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).