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Contents

README

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UM3088EESA

Union Semiconductor · RS-485 / RS-422 ICs · SOP-8

UM3088EESA from Union Semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: RO is high when A exceeds B by -50mV and low when A is less than B by 200mV.
2 RE input Active-low receiver output enable: RO is high impedance when RE is high, and driving RE high with DE low puts the device into low-power shutdown.
3 DE input Driver enable: drive DE high to enable the drivers, and the outputs are high impedance when DE is low.
4 DI input Driver input: a low on DI forces output A low and output B high, and a high on DI forces output A high and output B low.
5 GND power_in Ground pin for the device.
6 A bidirectional Non-inverting receiver input and non-inverting driver output, with ESD protection of ±15kV (Human Body Model and IEC61000-4-2 Air-Gap).
7 B bidirectional Inverting receiver input and inverting driver output, with ESD protection of ±15kV (Human Body Model and IEC61000-4-2 Air-Gap).
8 VCC power_in Power supply for the RS-485 transceiver, specified at +5V ±5% with an absolute maximum of +7V.

Key specifications

Parameter Value
Manufacturer Union Semiconductor
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC Supply Voltage VCC 7 V 3
Control Input Voltage (RE, DE) -0.3 V 3
Driver Input Voltage (DI) -0.3 V 3
Driver Output Voltage (A, B) -7.5 12.5 V 3
Receiver Input Voltage (A, B) -7.5 12.5 V 3
Receiver Output Voltage (RO) -0.3 V 3
Ambient Temperature TA -40 85 °C 3
Storage Temperature Range TSTG -65 160 °C 3
Lead Temperature for Soldering TL 300 °C 10 seconds 3
Supply Current ICC 0.3 mA No Load, DI=GND or VCC, DE=VCC, RE=0V or VCC 4
Supply Current ICC 0.25 mA No Load, DI=GND or VCC, DE=0V, RE=0V 4
Supply Current in Shutdown Mode ISHDN 0.002 10 µA DE=GND, RE=VCC 4
Logic Input High Voltage VIH1 2 V DE, DI, RE 4
Logic Input Low Voltage VIL1 0.8 V DE, DI, RE 4
Differential Driver Output VOD1 5 V No Load, Figure 2 4
Differential Driver Output VOD2 1.5 V Figure 2, R=50Ω 4
Change-in-Magnitude of Differential Output Voltage ΔVOD 0.2 V Figure 2, R=50Ω (Note 2) 4
Driver Common-Mode Output Voltage VOC 3 V Figure 2, R=50Ω 4
Change-in-Magnitude of Common-Mode Voltage ΔVOC 0.2 V Figure 2, R=50Ω (Note 2) 4
Driver Short-Circuit Output Current IOSD -250 mA VOUT=-7V (Note 3) 4
Driver Short-Circuit Output Current IOSD 250 mA VOUT=12V (Note 3) 4
Receiver Differential Threshold Voltage VTH -200 -50 mV -7V≤VCM≤12V 5
Receiver Input Resistance RIN 96 kΩ -7V≤VCM≤12V 5
Input Current (A and B) IIN2 1 mA DE=GND, VCC=GND or 5V; VIN=12V 5
Input Current (A and B) IIN2 -0.8 mA DE=GND, VCC=GND or 5V; VIN=-7V 5
Receiver Output Low Voltage VOL 0.4 V IO=2.5mA, VID=200mV 5
Three-State Output Current at Receiver IOZR -1 1 µA VCC=5V, 0V≤VO≤VCC 5
Receiver Output Short Circuit Current IOSR -60 60 mA 0V≤VRO≤VCC 5
ESD Protection, Human Body Model (A, B) -15 15 kV A, B pins 5
ESD Protection, IEC61000-4-2 Air-Gap (A, B) -15 15 kV A, B pins 5
ESD Protection, IEC61000-4-2 Contact (A, B) -8 8 kV A, B pins 5
Maximum Data Rate fMAX 2.5 Mbps 7
Driver Input-to-Output (low-to-high) tDPLH 34 60 ns Figure 3 and 7, RDIFF=54Ω, CL1=CL2=100pF 7
Driver Input-to-Output (high-to-low) tDPHL 34 60 ns Figure 3 and 7, RDIFF=54Ω, CL1=CL2=100pF 7
Driver Output Skew /tDPLH - tDPHL/ 2.5 10 ns Figure 3 and 7, RDIFF=54Ω, CL1=CL2=100pF 7
Driver Rise or Fall Time tDR, tDF 14 25 ns Figure 3 and 7, RDIFF=54Ω, CL1=CL2=100pF 7
Driver Enable to Output High tDZH 150 ns Figure 4 and 8, CL=100pF, S2 Closed 7
Driver Enable to Output Low tDZL 150 ns Figure 4 and 8, CL=100pF, S1 Closed 7
Driver Disable Time from Low tDLZ 100 ns Figure 4 and 8, CL=15pF, S1 Closed 7
Driver Disable Time from High tDHZ 100 ns Figure 4 and 8, CL=15pF, S2 Closed 7
Receiver Input to Output tRPLH, tRPHL 106 150 ns /VID/≥2.0V, Rise and Fall Time of VID≤15ns 7
Differential Receiver Skew /tRPLH - tRPHL/ 0 10 ns Figure 6 and 9, /VID/≥2.0V, Rise and Fall Time of VID≤15ns 7
Receiver Enable to Output Low tRZL 20 50 ns Figure 5 and 10, CL=100pF, S1 Closed 7
Receiver Enable to Output High tRZH 20 50 ns Figure 5 and 10, CL=100pF, S2 Closed 7
Receiver Disable Time from Low tRLZ 20 50 ns Figure 5 and 10, CL=100pF, S1 Closed 7
Receiver Disable Time from High tRHZ 20 50 ns Figure 5 and 10, CL=100pF, S2 Closed 7
Time to Shutdown tSHDN 50 200 600 ns (Note 4) 7
Driver Enable from Shutdown to Output High tDZH(SHDN) 250 ns Figure 4 and 8, CL=15pF, S2 Closed 7
Driver Enable from Shutdown to Output Low tDZL(SHDN) 250 ns Figure 4 and 8, CL=15pF, S1 Closed 7
Receiver Enable from Shutdown to Output High tRZH(SHDN) 3500 ns Figure 5 and 10, CL=100pF, S2 Closed 7
Receiver Enable from Shutdown to Output Low tRZL(SHDN) 3500 ns Figure 5 and 10, CL=100pF, S1 Closed 7

CAD (KiCad official)

  • Symbol: UM3088EESA
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: um3088eesa-etched.step / um3088eesa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); um3088eesa.step / um3088eesa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Union Semiconductor datasheet (14 pp, sha256 1afca2d01d12f207, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF