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Contents

README

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DMG2302UKQ-7

Diodes Incorporated · MOSFETs · SOT-23

DMG2302UKQ-7 from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate, ESD protected by an internal gate protection diode; VGSS is ±12 V maximum and VGS(TH) is 0.3 V min to 1.0 V max.
2 S passive Source terminal of the N-channel MOSFET, with the body diode rated at IS 1.1 A maximum continuous forward current.
3 D passive Drain terminal of the N-channel MOSFET, rated VDSS 20 V with ID 2.8 A at VGS = 4.5V, TA = +25°C.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 V VGS = 0V, ID = 250µA 2
Zero Gate Voltage Drain Current, TJ = +25°C IDSS 10 µA VDS = 16V, VGS = 0V 2
Gate-Source Leakage IGSS -10 10 µA VGS = ±10V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 0.3 0.6 1 V VDS = VGS, ID = 250µA 2
Static Drain-Source On-Resistance RDS(ON) 61 90 mΩ VGS = 4.5V, ID = 3.6A 2
Static Drain-Source On-Resistance RDS(ON) 80 120 mΩ VGS = 2.5V, ID = 3.1A 2
Diode Forward Voltage VSD 0.7 1.2 V VGS = 0V, IS = 1.0A 2
Drain-Source Voltage VDSS 20 V 2
Gate-Source Voltage VGSS -12 12 V 2
Continuous Drain Current, TA = +25°C ID 2.8 A VGS = 4.5V, steady state (Note 7) 2
Continuous Drain Current, TA = +70°C ID 2.2 A VGS = 4.5V, steady state (Note 7) 2
Maximum Continuous Body Diode Forward Current IS 1.1 A Note 7 2
Pulsed Drain Current IDM 12 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation PD 0.66 W Device on FR-4 PCB with minimum recommended pad layout (Note 6) 2
Thermal Resistance, Junction to Ambient, Steady State RθJA 192 °C/W Device on FR-4 PCB with minimum recommended pad layout (Note 6) 2
Total Power Dissipation PD 1.1 W Device on 1in x 1in FR-4 PCB, high-coverage 2oz copper, single sided (Note 7) 2
Thermal Resistance, Junction to Ambient, Steady State RθJA 115 °C/W Device on 1in x 1in FR-4 PCB, high-coverage 2oz copper, single sided (Note 7) 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals: Finish - Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: DMG2302UKQ-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: dmg2302ukq-7-etched.step / dmg2302ukq-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmg2302ukq-7.step / dmg2302ukq-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 00c7643a03871ac3, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF