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README

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XW12A SOP24

Sam wing · Touch Sensors · SOP-24

XW12A SOP24 from Sam wing, in a SOP-24. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Power ground (电源地) for the device.
2 C1 passive Internal balance capacitor interface; the datasheet gives a 1nF to 10nF range and recommends 4.7nF, placed as close to the IC as possible.
3 CSEL passive Sensitivity-setting capacitor interface; the value range is 0 to 100pF, with smaller values giving higher sensitivity and leaving it floating (0pF) also allowed.
4 PAD0 passive Touch key pad 0; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
5 PAD1 passive Touch key pad 1; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
6 PAD2 passive Touch key pad 2; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
7 PAD3 passive Touch key pad 3; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
8 PAD4 passive Touch key pad 4; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
9 PAD5 passive Touch key pad 5; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
10 PAD6 passive Touch key pad 6; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
11 PAD7 passive Touch key pad 7; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
12 PAD8 passive Touch key pad 8; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
13 PAD9 passive Touch key pad 9; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
14 PAD10 passive Touch key pad 10; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
15 PAD11 passive Touch key pad 11; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad.
16 NC unconnected Internal test pin; leave floating (悬空).
17 NC unconnected Internal test pin; leave floating (悬空).
18 INT output Key-valid output as an NMOS open-drain: it goes low when any key is pressed and is high-impedance when no key is pressed.
19 ASEL input I2C address select; high, low or floating sets the device address to 44H, 42H or 40H respectively.
20 AO output Analog voltage output that outputs VDD when no key is pressed and a fraction of VDD (2/16 to 13/16 VDD, by key) when a key is pressed.
21 SCL input I2C clock input; both SDA and SCL require a pull-up resistor to the supply.
22 SDA bidirectional I2C serial data input/output; the device is read-only and is pulled low for ACK and used for the sleep-exit low pulse.
23 BUZZ output Buzzer driver output producing a fixed 2.7 kHz square wave that can directly drive a buzzer (rated source 30 mA and sink 30 to 40 mA at VDD=5V).
24 VDD power_in Positive supply; operating voltage range is 2.5 V to 5.5 V and absolute maximum is -0.3 V to 6.0 V.

Key specifications

Parameter Value
Manufacturer Sam wing
Package SOP-24
Category Sensors
Pins 24

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
工作电压 (operating voltage) VDD 2.5 5.5 V 5
灵敏度电容 (sensitivity capacitor) CSEL 0 100 pF 5
芯片感应电容范围 (sensing capacitance range) C_in 0.2 200 pF 5
模拟电压输出内阻 (analog voltage output impedance) Z_AO 20 25 30 kΩ 5
VDD voltage (absolute maximum) VDD -0.3 6 V 4
输入输出电压 (input/output voltage) -0.3 6 V 4
工作温度范围 (operating temperature range) -40 85 ℃ 4
存储温度范围 (storage temperature range) -55 150 ℃ 4
ESD, HUM ESD,HUM 8000 V 4
C1 内部平衡电容取值范围 (internal balance capacitor C1) C1 1 4.7 10 nF Recommended 4.7nF per datasheet note 4

CAD (KiCad official)

  • Symbol: XW12A SOP24
  • Footprint: Package_SO:SOP-24_7.5x15.4mm_P1.27mm
  • 3D model: SOP-24, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: xw12a-sop24-etched.step / xw12a-sop24-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xw12a-sop24.step / xw12a-sop24.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Sam wing datasheet (11 pp, sha256 dd590366b2dc4fe6, retrieved 2026-10-20, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF