component
DRV5053CAQDBZR
Public Made by Adomby adom
Texas Instruments Hall Sensor, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownDRV5053CAQDBZR
Texas Instruments · Hall Sensor · SOT-23
DRV5053CAQDBZR from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | 2.5 V to 38 V power supply; bypass to GND with a 0.01-µF (minimum) ceramic capacitor rated for VCC. |
| 2 | OUT | output | Hall sensor analog output; 1 V output corresponds to B = 0 mT. |
| 3 | GND | power_in | Ground pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23 |
| Category | Sensors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage (abs max) | VCC | -22 | 40 | V | over operating free-air temperature range; -22 V specified by design, only tested to -20 V | 4 | |
| Voltage ramp rate (VCC > 5 V) | 0 | 2 | V/µs | VCC > 5 V | 4 | ||
| Output pin voltage | -0.5 | 2.5 | V | 4 | |||
| Output pin reverse current during reverse supply condition | 0 | -20 | mA | 4 | |||
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | -2500 | 2500 | V | Human body model, all pins | 4 | |
| ESD CDM | V(ESD) | -500 | 500 | V | Charged device model, all pins | 4 | |
| Power supply voltage | VCC | 2.5 | 38 | V | 4 | ||
| Output pin voltage (OUT) | VOUT | 0 | 2 | V | 4 | ||
| Output pin current source | ISOURCE | 0 | 300 | µA | 4 | ||
| Output pin current sink | ISINK | 0 | 2.3 | mA | 4 | ||
| Operating ambient temperature | TA | -40 | 125 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 333.2 | °C/W | DBZ (SOT-23) | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 99.9 | °C/W | DBZ (SOT-23) | 4 | ||
| Junction-to-board thermal resistance | RθJB | 66.9 | °C/W | DBZ (SOT-23) | 4 | ||
| Junction-to-top characterization parameter | ψJT | 4.9 | °C/W | DBZ (SOT-23) | 4 | ||
| Junction-to-board characterization parameter | ψJB | 65.2 | °C/W | DBZ (SOT-23) | 4 | ||
| VCC operating voltage | VCC | 2.5 | 38 | V | 5 | ||
| Operating supply current | ICC | 2.7 | mA | VCC = 2.5 V to 38 V, TA = 25°C | 5 | ||
| Operating supply current | ICC | 3 | 3.6 | mA | VCC = 2.5 V to 38 V, TA = 125°C | 5 | |
| Power-on time | ton | 35 | 50 | µs | 5 | ||
| Reverse supply voltage | VCCR | -22 | V | 5 | |||
| Overcurrent protection level, sourcing | IOCP,SOURCE | 300 | µA | Sourcing current | 5 | ||
| Overcurrent protection level, sinking | IOCP,SINK | 2.3 | mA | Sinking current | 5 | ||
| Output delay time | td | 13 | 25 | µs | TA = 25°C | 5 | |
| Quiescent output | VQ | 0.9 | 1.02 | 1.15 | V | B = 0 mT, TA = -40°C to 125°C | 5 |
| Bandwidth | ƒBW | 20 | kHz | 5 | |||
| Input-referred noise | BN | 0.49 | 0.79 | mTpp | COUT = 50 pF, TA = -40°C to 125°C; min printed 0.40 | 5 | |
| Linearity | Le | 1 | % | -BSAT < B < BSAT | 5 | ||
| Output saturation voltage (minimum) | VOUT MIN | 0.2 | V | B < -BSAT | 5 | ||
| Output saturation voltage (maximum) | VOUT MAX | 1.8 | V | B > BSAT | 5 | ||
| Sensitivity (DRV5053CA) | S | 10 | 23 | 35 | mV/mT | VCC = 3.3 V, TA ≈ -40°C to 125°C | 6 |
| Output-referred noise (DRV5053CA) | VN | 11 | mVpp | VCC = 3.3 V; ROUT = 10 kΩ; COUT = 50 pF; TA ≈ -40°C to 125°C | 6 | ||
| Input saturation field (DRV5053CA) | BSAT | 35 | mT | VCC = 3.3 V, TA ≈ -40°C to 125°C | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | Abs | • Corrected body size of SOT-23 package and SIP package name to TO-92 ..................................................... 1 • Added BMAX to Absolute Maximum Ratings ................................. | 2 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
DRV5053CAQDBZR - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.37 mm, terminals on the pads, 1.12 mm tall, datasheet A, max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
drv5053caqdbzr-etched.step/drv5053caqdbzr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);drv5053caqdbzr.step/drv5053caqdbzr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (28 pp, sha256
80aebab55793b9b7, retrieved 2026-11-13, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).