NCP164ASN330T1G from onsemi, in a TSOP-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	IN	power_in	Input voltage supply pin; the operating input voltage range is 1.6 V to 5.5 V and the absolute maximum input voltage is −0.3 V to 6 V.
2	GND	power_in	Common ground connection for the regulator.
3	EN	input	Chip enable: VEN below 0.2 V disables the regulator and VEN above 0.7 V enables the LDO; the chip-enable input is rated −0.3 V to 6 V.
4	PG	output	Power Good open-collector output that needs a 10 kΩ to 100 kΩ pull-up resistor to the output or input voltage; the absolute maximum Power Good voltage is −0.3 V to 6 V and the absolute maximum Power Good current is 30 mA.
5	OUT	power_out	Regulated output voltage that should be bypassed with a small 1 µF ceramic capacitor; the output voltage is rated −0.3 V to VIN + 0.3 V, with a maximum of 6 V.

Key specifications

Parameter	Value
Manufacturer	onsemi
Package	TSOP-5
Category	Power Supply Chip
Pins	5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Operating Input Voltage	VIN	1.6		5.5	V		4
Output Voltage Accuracy	VOUT	-2		2	%	VIN = VOUT(NOM) + 0.5 V to 5.0 V, 0.1 mA ≤ IOUT ≤ 300 mA	4
Operating junction temperature range (electrical table header)	TJ	-40		150	°C	Stated as −40°C ≤ TJ ≤ 150°C for Table 4	4
Dropout Voltage, VOUT(NOM) = 3.3 V	VDO		110	170	mV	IOUT = 300 mA, VOUT(NOM) = 3.3 V	4
Quiescent Current	IQ		30	40	µA	IOUT = 0 mA	4
Shutdown Current	IDIS		0.01	1.5	µA	VEN ≤ 0.4 V	4
EN Pull Down Current	IEN		0.2	0.6	µA	VEN = 5.0 V	4
Input Voltage	VIN	-0.3		6	V		2
Output Voltage	VOUT	-0.3		6	V	Printed as −0.3 to VIN+0.3, max. 6	2
Chip Enable Input	VCE	-0.3		6	V		2
Power Good Voltage	VPG	-0.3		6	V		2
Power Good Current	IPG			30	mA		2
Maximum Junction Temperature	TJ			150	°C		2
Storage Temperature	TSTG	-55		150	°C		2
ESD Capability, Human Body Model	ESDHBM		2000		V	Tested per AEC−Q100−002	2
ESD Capability, Charged Device Model	ESDCDM		1000		V	Tested per EIA/JESD22−C101	2
Thermal Resistance, Junction-to-Ambient (TSOP-5)	RJA		158		°C/W	Note 3	3
Thermal Resistance, Junction-to-Case (top) (TSOP-5)	RJC(top)		155		°C/W		3
Thermal Resistance, Junction-to-Case (bottom) (TSOP-5)	RJC(bot)		102		°C/W	Note 4	3
Thermal Resistance, Junction-to-Board (TSOP-5)	RJB		197		°C/W		3
Characterization Parameter, Junction-to-Top (TSOP-5)	JT		40		°C/W		3
Characterization Parameter, Junction-to-Board (TSOP-5)	JB		82		°C/W		3

CAD (KiCad official)

Symbol: NCP164ASN330T1G
Footprint: Package_SO:TSOP-5_1.65x3.05mm_P0.95mm
3D model: TSOP-5 (KiCad packages3D, STEP)
3D model files: ncp164asn330t1g-etched.step / ncp164asn330t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp164asn330t1g.step / ncp164asn330t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: onsemi datasheet (11 pp, sha256 79dddb153261f9fb, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

NCP164ASN330T1G

Verified NCP164ASN330T1G

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3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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