component
WSB5508L-2
Public Made by Adomby adom
WILLSEMI Will Semicon Schottky Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownWSB5508L-2
WILLSEMI Will Semicon · Schottky Diodes · SOD-123
WSB5508L-2 from WILLSEMI Will Semicon, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the Schottky diode (banded end of the package); VR and VRM are rated 40 V, and average rectified forward current is 1 A. |
| 2 | A | passive | Anode of the Schottky diode; forward voltage is 0.57 V max at IF=1A and peak forward current is 25 A (1 us single pulse). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | WILLSEMI Will Semicon |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage (repetitive peak) | VRM | 40 | V | 1 | |||
| Reverse voltage (DC) | VR | 40 | V | 1 | |||
| Average rectified forward current | IO | 1 | A | 1 | |||
| Peak forward current | IPK | 25 | A | Note 1: Pulse Width=1us, Single Pulse | 1 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 1 | ||
| Junction Temperature | -55 | 150 | °C | 1 | |||
| Forward voltage | VF | 0.57 | V | IF=1A | 1 | ||
| Reverse current | IR | 100 | uA | VR=40V | 1 | ||
| Junction capacitance | CJ | 105 | pF | VR=4V, F=1MHz | 1 | ||
| Thermal resistance, junction to lead | RθJL | 120 | K/W | Junction to lead | 1 |
CAD (KiCad official)
- Symbol:
WSB5508L-2 - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files:
wsb5508l-2-etched.step/wsb5508l-2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);wsb5508l-2.step/wsb5508l-2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: WILLSEMI Will Semicon datasheet (3 pp, sha256
f2ff7450f54a36ce, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).