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HGV8551M5
Public Made by Adomby adom
HGSEMI Operational Amplifier, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHGV8551M5
HGSEMI · Operational Amplifier · SOT-23-5
HGV8551M5 from HGSEMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Amplifier output with rail-to-rail swing, driving up to 65mA output current (60mA short-circuit limit). |
| 2 | VSS | power_in | Negative supply or ground; the datasheet allows single supply 1.8V to 5.5V or dual ±0.9V to ±2.75V. |
| 3 | IN+ | input | Non-inverting input with rail-to-rail common-mode range from VSS-0.1V to VDD+0.1V. |
| 4 | IN- | input | Inverting input with rail-to-rail common-mode range from VSS-0.1V to VDD+0.1V. |
| 5 | VDD | power_in | Positive supply, 1.8V to 5.5V (absolute maximum 7.5V); bypass with a 0.1µF ceramic capacitor placed close to the pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOT-23-5 |
| Category | Amplifiers/Comparators |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | 1 | 30 | µV | VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ (table header) | 4 | |
| Input Offset Voltage Drift | ∆VOS/∆T | 10 | 50 | nV/℃ | VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ (table header) | 4 | |
| Power Supply Voltage (VDD to Vss) | VDD to Vss | -0.5 | 7.5 | V | 3 | ||
| PDB Input Voltage | 7 | V | 3 | ||||
| Operating Temperature Range | -40 | 85 | °C | 3 | |||
| Junction Temperature | 160 | °C | 3 | ||||
| Storage Temperature Range | -55 | 150 | °C | 3 | |||
| Lead Temperature | 260 | °C | soldering, 10 sec | 3 | |||
| Package Thermal Resistance, SOT-23-5 | θJA | 190 | °C/W | TA = +25℃, SOT-23-5 | 3 | ||
| ESD Susceptibility HBM | 6 | KV | HBM | 3 | |||
| ESD Susceptibility MM | 400 | V | MM | 3 | |||
| Single Supply Operating Voltage | 1.8 | 5.5 | V | single supply | 7 | ||
| Dual Supply Operating Voltage | 0.9 | 2.75 | V | dual supply, each supply ±0.9V to ±2.75V | 7 |
CAD (KiCad official)
- Symbol:
HGV8551M5 - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
hgv8551m5-etched.step/hgv8551m5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgv8551m5.step/hgv8551m5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (14 pp, sha256
15ddc9477dd7d599, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).