component
BQ24315DSGT
Public Made by Adomby adom
Texas Instruments Battery Management ICs, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBQ24315DSGT
Texas Instruments · Battery Management ICs · WSON-8-EP(2x2)
BQ24315DSGT from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input power connection to the external DC supply, which must be bypassed to VSS with at least a 1 µF ceramic capacitor, with input voltage range 3.3 V to 30 V and input current limited to 1.5 A. |
| 2 | VSS | power_in | Ground terminal that must be connected to ground at all times, and is internally connected to the exposed thermal pad. |
| 3 | NC | unconnected | Internal test pin that may have internal circuits, so no external connection should be made to it for normal operation. |
| 4 | FAULT | output | Open-drain, active-low device status output that goes low for input overvoltage, input overcurrent, battery overvoltage, or thermal shutdown, is high impedance in normal operation, requires a pullup resistor to the logic rail, and has a maximum sink current of 15 mA. |
| 5 | CE | input | Active-low chip enable input where CE high disables the IC and turns the input FET off and CE low gives normal operation; it is internally pulled down, with VIL maximum 0.4 V and VIH minimum 1.4 V. |
| 6 | VBAT | power_in | Battery voltage sense input connected to the battery pack positive terminal through a resistor, used against the internally set battery overvoltage threshold BVOVP of 4.30 V to 4.4 V (4.35 V typical). |
| 7 | ILIM | bidirectional | Input overcurrent threshold programming pin where a resistor from ILIM to VSS sets IOCP according to IOCP = 25 / R(ILIM), with R(ILIM) specified from 15 kΩ to 90 kΩ. |
| 8 | OUT | power_out | Output terminal to the charging system that must be bypassed to VSS with at least a 1 µF ceramic capacitor, with output current limited to 1.5 A. |
| 9 | PowerPAD | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Supply Chip |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage range | VIN | 3.3 | 30 | V | Over operating free-air temperature range (unless otherwise noted) | 2 | |
| Input current, IN pin | IIN | 1.5 | A | Over operating free-air temperature range (unless otherwise noted) | 2 | ||
| Output current, OUT pin | IOUT | 1.5 | A | Over operating free-air temperature range (unless otherwise noted) | 2 | ||
| OCP programming resistor | R(ILIM) | 15 | 90 | kΩ | Over operating free-air temperature range (unless otherwise noted) | 2 | |
| Junction temperature (recommended) | TJ | -40 | 125 | °C | Over operating free-air temperature range (unless otherwise noted) | 2 | |
| Input voltage IN (with respect to VSS) | VI | -0.3 | 30 | V | With respect to VSS | 2 | |
| Input voltage OUT (with respect to VSS) | VI | -0.3 | 12 | V | With respect to VSS | 2 | |
| Input voltage ILIM, FAULT, CE, VBAT (with respect to VSS) | VI | -0.3 | 7 | V | With respect to VSS | 2 | |
| Input current, IN | I | 2 | A | 2 | |||
| Output current, OUT | IO | 2 | A | 2 | |||
| Output sink current, FAULT | I | 15 | mA | 2 | |||
| ESD withstand voltage, Human Body Model | 2000 | V | All pins, per JESD22-A114-E | 2 | |||
| ESD withstand voltage, Machine Model | 200 | V | All pins, per JESD22-A115-E | 2 | |||
| ESD withstand voltage, Charge Device Model | 500 | V | All pins, per JESD22-C101-C | 2 | |||
| ESD withstand voltage, IEC 61000-4-2 air discharge | 15 | kV | IN pin; IN bypassed to VSS with 1-µF low-ESR ceramic capacitor; air discharge | 2 | |||
| ESD withstand voltage, IEC 61000-4-2 contact discharge | 8 | kV | IN pin; IN bypassed to VSS with 1-µF low-ESR ceramic capacitor; contact discharge | 2 | |||
| Junction temperature | TJ | -40 | 150 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 2 | ||
| Junction-to-case thermal resistance (DSG 2×2 SON) | RθJC | 5 | °C/W | DSG package, 2×2 SON | 2 | ||
| Junction-to-ambient thermal resistance (DSG 2×2 SON) | RθJA | 75 | °C/W | DSG package, 2×2 SON | 2 | ||
| Undervoltage lock-out threshold, input power detected | UVLO | 2.6 | 2.7 | 2.8 | V | CE = Low, VIN increasing from 0V to 3V | 3 |
| Hysteresis on UVLO | Vhys(UVLO) | 200 | 260 | 300 | mV | CE = Low, VIN decreasing from 3V to 0V | 3 |
| Operating current | IDD | 400 | 600 | µA | CE = Low, No load on OUT pin, VIN = 5V, R(ILIM) = 25kΩ | 3 | |
| Standby current | ISTDBY | 65 | 95 | µA | CE = High, VIN = 5V | 3 | |
| Drop-out voltage IN to OUT | VDO | 170 | 280 | mV | CE = Low, VIN = 5V, IOUT = 1A | 3 | |
| Output voltage (bq24315) | VO(REG) | 5.3 | 5.5 | 5.7 | V | CE = Low, VIN = 5.7V, IOUT = 1A | 3 |
| Input overvoltage protection threshold (bq24315) | VOVP | 5.71 | 5.85 | 6 | V | CE = Low, VIN increasing from 5V to 11V | 3 |
| Hysteresis on OVP (bq24315) | Vhys(OVP) | 20 | 60 | 110 | mV | CE = Low, VIN decreasing from 11V to 5V | 3 |
| Input overcurrent protection threshold range | IOCP | 300 | 1500 | mA | 3 | ||
| Input overcurrent protection threshold | IOCP | 900 | 1000 | 1100 | mA | CE = Low, R(ILIM) = 24.9kΩ, 3 V ≤ VIN < VOVP, Vhys(OVP) | 3 |
| Battery overvoltage protection threshold | BVOVP | 4.3 | 4.35 | 4.4 | V | CE = Low, VIN > 4.4V | 3 |
| Hysteresis on BVOVP | Vhys(Bovp) | 200 | 275 | 320 | mV | CE = Low, VIN > 4.4V | 3 |
| Low-level input voltage on CE | VIL | 0 | 0.4 | V | 3 |
CAD (KiCad official)
- Symbol:
BQ24315DSGT - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
bq24315dsgt-etched.step/bq24315dsgt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bq24315dsgt.step/bq24315dsgt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (24 pp, sha256
a4ecae64eb31413a, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).