component
F06T1
Public Made by Adomby adom
TLC Electronic Disposable Fuses, 0603. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownF06T1
TLC Electronic · Disposable Fuses · 0603
F06T1 from TLC Electronic, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One end termination of the 1 A, 32 V DC rated time-delay fuse (typical cold resistance 230 mOhms, breaking capacity 50 A); the fuse is non-polarized. |
| 2 | 2 | passive | Other end termination of the 1 A, 32 V DC rated time-delay fuse (typical voltage drop 335 mV); the fuse is non-polarized and interchangeable with pin 1. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature | -55 | 125 | ℃ | with proper correction factor applied | 5 | ||
| Time-current: 1.0In | 4 | hour | 1.0In | 2 | |||
| Time-current: 2.5In | 5 | sec | 2.5In | 2 | |||
| Wave solder time in reservoir | 10 | seconds | Wave solder, time in reservoir | 4 | |||
| Infrared reflow time | 30 | seconds | Infrared reflow, time | 4 | |||
| Infrared reflow temperature | 260 | ℃ | Infrared reflow, temperature | 4 | |||
| Peak package body temperature (TP) | TP | 260 | ℃ | Lead(Pb) free solder reflow profile | 5 | ||
| Preheat temperature min. (Tsmin) | Tsmin | 150 | ℃ | Lead(Pb) free solder reflow profile, preheat and soak | 4 | ||
| Preheat temperature max. (Tsmax) | Tsmax | 200 | ℃ | Lead(Pb) free solder reflow profile, preheat and soak | 4 | ||
| Time (Tsmin to Tsmax) | tS | 60 | 120 | Seconds | Lead(Pb) free solder reflow profile | 5 | |
| Time at liquidous | tL | 60 | 150 | Seconds | Lead(Pb) free solder reflow profile | 5 | |
| Time within 5℃ of classification temperature (TC) | tP | 30 | Seconds | Lead(Pb) free solder reflow profile | 5 | ||
| Average ramp up rate Tsmax to Tp | 3 | ℃ / Second | Lead(Pb) free solder reflow profile | 5 | |||
| Average ramp-down rate (TP to Tsmax) | 6 | ℃ / Second | Lead(Pb) free solder reflow profile | 5 | |||
| Time (25℃ to Peak Temperature) | 8 | Minutes | Lead(Pb) free solder reflow profile | 5 | |||
| Rated voltage | 32 | V | 2 | ||||
| Rated current | 1 | A | 2 | ||||
| Breaking capacity (DC interrupting rating) | 50 | A | Measured at rated voltage, time constant of less than 50 microseconds, battery source | 2 | |||
| Typical cold resistance | 230 | mOhms | Measured at <10% of rated current, ambient 25 degrees | 2 | |||
| Typical voltage drop | 335 | mV | 2 | ||||
| Typical pre-arcing I2t | I2t | 0.011 | A2Sec | Measured at 10In current | 2 | ||
| Liquidous temperature (TL) | TL | 217 | ℃ | Lead(Pb) free solder reflow profile | 5 | ||
| Wave solder reservoir temperature | 260 | ℃ | Wave solder | 4 |
CAD (KiCad official)
- Symbol:
F06T1 - Footprint:
Fuse:Fuse_0603_1608Metric - 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files:
f06t1-etched.step/f06t1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);f06t1.step/f06t1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TLC Electronic datasheet (5 pp, sha256
e9ac227fba594b08, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).