Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

RT6365GSP

Richtek Tech · DC-DC Converters · SOP-8-EP

RT6365GSP from Richtek Tech, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT passive Bootstrap capacitor connection node that supplies the high-side gate driver; connect a 0.1µF ceramic capacitor between this pin and SW.
2 VIN power_in Power input with a stated input voltage range of 4V to 60V; connect input capacitors between this pin and GND, usually four 2.2µF or larger ceramic capacitors with two typical capacitance 4.7µF.
3 EN input Enable control with an internal pull-up current source; floating or a logic-high level (1.2V threshold as printed) enables the converter, and a logic-low forces shutdown mode.
4 RT/SYNC input Frequency setting and external synchronization input; connect a resistor to GND to set the switching frequency, or tie to a clock source to synchronize from 300kHz to 2200kHz.
5 FB input Output voltage sense input through a resistive divider, with a feedback reference voltage of 0.8V typically.
6 COMP passive Compensation node where external compensation elements are connected to stabilize the control loop.
7 GND power_in Ground; provides the ground return path for the control circuitry.
8 SW output Switch node that supplies power to the output; connect the output LC filter from SW to the output load.
9 PAD passive Exposed pad, internally unconnected, that must be soldered to a large PCB copper area for maximum power dissipation.

Key specifications

Parameter Value
Manufacturer Richtek Tech
Package SOP-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 4 60 V After soft-start is finished 11
VIN Under-Voltage Lockout Threshold (rising) VUVLOH 4.1 4.3 4.5 V VIN rising 11
VIN Under-Voltage Lockout Threshold (falling) VUVLOL 3.8 3.9 4 V VIN falling 11
Shutdown Current ISHDN 2.25 5 μA VEN = 0V 11
Quiescent Current IQ 100 135 μA VEN = 2V, VFB = 0.83V, not switching 11
Enable Threshold Voltage VTH_EN 1.1 1.2 1.3 V 11
Enable Pull-Up Current IEN 0.58 1.2 1.8 μA VTH_EN − 50mV 11
Enable Hysteresis Current IEN_Hys 2.2 3.4 4.5 μA 11
Reference Voltage VREF 0.792 0.8 0.808 V 11
High-Side Switch On-Resistance RDS(ON)_H 70 140 mΩ VIN = 12V, VBOOT − VSW = 5V 11
Current Limit ILIM 6.375 7.5 8.625 A fSW = 500kHz, VOUT = 5V 11
Minimum On-Time tON_MIN 135 ns IOUT = 1A 12
Switching Frequency 1 fSW1 90 105 120 kHz RRT/SYNC = 1M 12
Switching Frequency 2 fSW2 450 500 550 kHz RRT/SYNC = 200k 12
Switching Frequency 3 fSW3 2200 2450 2700 kHz RRT/SYNC = 37.4k 12
SYNC Frequency Range 0.3 2.2 MHz External clock 12
SYNC Threshold Voltage (high) VIH_SYNC 1.55 2 V 12
SYNC Threshold Voltage (low) VIL_SYNC 0.5 1.2 V 12
Soft-Start Period 1.4 2 2.6 ms 10% to 90%, RT6365GSP 12
Input Voltage (absolute maximum, VIN supply) VIN -0.3 65 V 10
Enable Voltage -0.3 65 V EN pin 10
Switch Voltage -0.6 65 V SW pin 10
Switch Voltage (transient) -5 70 V SW (t ≤ 100ns) 10
Power Good Voltage -0.3 65 V PGOOD pin 10
BOOT to SW Voltage BOOT−SW -0.3 6 V 10
All Other Pins Voltage -0.3 6 V 10
Lead Temperature 260 °C Soldering, 10 sec. 10
Junction Temperature 150 °C 10
Storage Temperature Range -65 150 °C 10
ESD Susceptibility HBM 2 kV HBM (Human Body Model) 10
Supply Input Voltage VIN 4 60 V 10
Output Voltage 0.8 V Upper limit printed as VIN (not numeric) 10
Junction Temperature Range -40 125 °C 10
Junction-to-ambient thermal resistance θJA 30.4 C/W JEDEC standard, SOP-8 (Exposed pad) column 10
Junction-to-case (top) thermal resistance θJC(Top) 73.9 C/W SOP-8 (Exposed pad) column 10
Junction-to-case (bottom) thermal resistance θJC(Bottom) 3.4 C/W SOP-8 (Exposed pad) column 10
Junction-to-ambient thermal resistance (specific EVB) θJA(EVB) 30 C/W Specific EVB, SOP-8 (Exposed pad) column 10
Junction-to-top characterization parameter JC(Top) 5 C/W SOP-8 (Exposed pad) column 10
Junction-to-board characterization parameter JB 13.2 C/W SOP-8 (Exposed pad) column 10

CAD (KiCad official)

  • Symbol: RT6365GSP
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: rt6365gsp-etched.step / rt6365gsp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rt6365gsp.step / rt6365gsp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Richtek Tech datasheet (35 pp, sha256 839cd4f496f65ca6, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF