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Contents

README

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BZD27C180P

LGE · Zener Diodes · SOD-123FL

BZD27C180P from LGE, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation.
2 2 passive Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation.

Key specifications

Parameter Value
Manufacturer LGE
Package SOD-123FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (Zener voltage) at IZT Vz 168 191 V Vz@IzT, IZT = 5 mA (regulator table, H1 row) 2
Temperature coefficient at Iz αz 0.09 0.13 %/ αz@Iz, IZT = 5 mA (regulator table, H1 row) 2
Differential resistance at Iz rdif 180 400 Ω rdif@Iz, IZT = 5 mA (regulator table, H1 row) 2
Reverse current at reverse voltage IR 1 µA VR = 130 V (regulator table, H1 row) 2
Reverse breakdown voltage V(BR)R 168 V Itest = 5 mA (protection table, N2 marking) 3
Temperature coefficient at Itest αz 0.09 0.13 %/ αz@Itest, Itest = 5 mA (protection table, N2 marking) 3
Clamping voltage VC 229 V @ IRSM = 0.43 A (protection table, N2 marking) 3
Reverse current at stand-off voltage IR 5 µA @ VWM = 150 V (protection table, N2 marking) 3
Non-repetitive peak pulse power dissipation PPPM 150 Watts 10/1000 µs waveform (NOTE 1), TJ=25 prior to surge 1
Power dissipation at TA=25 Ptot 0.8 Watts TA=25 (NOTE 2), mounted on epoxy-glass PCB with 3×3 mm Cu pads (40µm thick) 1
Maximum instantaneous forward voltage VF 1.2 Volts at 0.2 A 1
Thermal resistance junction to ambient RθJA 180 K/W junction to ambient 1
Operating temperature junction range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1

CAD (KiCad official)

  • Symbol: BZD27C180P
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123FL (KiCad packages3D, STEP)
  • 3D model files: bzd27c180p-etched.step / bzd27c180p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzd27c180p.step / bzd27c180p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LGE datasheet (4 pp, sha256 9407d6b333d8566a, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF