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Contents

README

markdown

ESD8D8V0

MDD(Microdiode Electronics) · ESD Protection Devices · DFN1006-2

ESD8D8V0 from MDD(Microdiode Electronics), in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer MDD(Microdiode Electronics)
Package DFN1006-2
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse working voltage (ESD8D8V0) VRWM 8 V 2
Reverse leakage current (ESD8D8V0) IR 1 µA 2
Breakdown voltage (ESD8D8V0) VB 8.5 V 2
Test current (ESD8D8V0) IT 1 mA 2
Clamping voltage, first VC column (ESD8D8V0) VC 15 V @ 5.0 A (first VC column, printed @A) 2
Clamping voltage, second VC column (ESD8D8V0) VC 18 V @ 6.0 A (second VC column, printed @A) 2
Peak pulse power (ESD8D8V0) PPK 108 W 2
Junction capacitance (ESD8D8V0) CJ 65 Pf 2
ESD per IEC 61000-4-2 (Air) VESD -30 30 KV ESD per IEC 61000-4-2 (Air), printed ± 30 1
ESD per IEC 61000-4-2 (Contact) VESD -22 22 KV ESD per IEC 61000-4-2 (Contact), printed ± 22 1
Operating temperature TOPT -55 125 °C 1
Total power dissipation PD 150 mW Total power dissipation on FR-5 Board (Note 1) @ Ta=25C 1
Storage temperature TSTG -55 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts gold  Terminals: Gold plated, solderable per MIL-STD-750, method 2026 1

CAD (KiCad official)

  • Symbol: ESD8D8V0
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2 (KiCad packages3D, STEP)
  • 3D model files: esd8d8v0-etched.step / esd8d8v0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd8d8v0.step / esd8d8v0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD(Microdiode Electronics) datasheet (4 pp, sha256 1944e50ff2aa3c10, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF