ESD8D8V0
Public Made by Adomby adom
MDD(Microdiode Electronics) ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownESD8D8V0
MDD(Microdiode Electronics) · ESD Protection Devices · DFN1006-2
ESD8D8V0 from MDD(Microdiode Electronics), in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MDD(Microdiode Electronics) |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse working voltage (ESD8D8V0) | VRWM | 8 | V | 2 | |||
| Reverse leakage current (ESD8D8V0) | IR | 1 | µA | 2 | |||
| Breakdown voltage (ESD8D8V0) | VB | 8.5 | V | 2 | |||
| Test current (ESD8D8V0) | IT | 1 | mA | 2 | |||
| Clamping voltage, first VC column (ESD8D8V0) | VC | 15 | V | @ 5.0 A (first VC column, printed @A) | 2 | ||
| Clamping voltage, second VC column (ESD8D8V0) | VC | 18 | V | @ 6.0 A (second VC column, printed @A) | 2 | ||
| Peak pulse power (ESD8D8V0) | PPK | 108 | W | 2 | |||
| Junction capacitance (ESD8D8V0) | CJ | 65 | Pf | 2 | |||
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | 30 | KV | ESD per IEC 61000-4-2 (Air), printed ± 30 | 1 | |
| ESD per IEC 61000-4-2 (Contact) | VESD | -22 | 22 | KV | ESD per IEC 61000-4-2 (Contact), printed ± 22 | 1 | |
| Operating temperature | TOPT | -55 | 125 | °C | 1 | ||
| Total power dissipation | PD | 150 | mW | Total power dissipation on FR-5 Board (Note 1) @ Ta=25C | 1 | ||
| Storage temperature | TSTG | -55 | 150 | °C | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | gold | Terminals: Gold plated, solderable per MIL-STD-750, method 2026 | 1 |
CAD (KiCad official)
- Symbol:
ESD8D8V0 - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
esd8d8v0-etched.step/esd8d8v0-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd8d8v0.step/esd8d8v0.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MDD(Microdiode Electronics) datasheet (4 pp, sha256
1944e50ff2aa3c10, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).