Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ESP32-H2FH4S

Espressif Systems · RF and Wireless · 32-VFQFN Exposed Pad

ESP32-H2FH4S from Espressif Systems, in a 32-VFQFN Exposed Pad. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD3P3 power_in Input supply for the analog power domain (VDD3P3).
2 VDD3P3 power_in Input supply for the analog power domain (VDD3P3).
3 GPIO0 bidirectional Digital IO powered from VDDPST1; default drive strength is 20 mA, with IO MUX alternate function FSPIQ.
4 GPIO1 bidirectional Digital IO powered from VDDPST1; default drive strength is 20 mA, also ADC1_CH0 analog function.
5 MTMS bidirectional JTAG Test Mode Select, powered from VDDPST1, input enabled at reset and after reset; also ADC1_CH1 analog function.
6 MTDO bidirectional JTAG Test Data Out, powered from VDDPST1, input enabled at reset and after reset; also ADC1_CH2 analog function.
7 MTCK bidirectional JTAG Test Clock, powered from VDDPST1; input enable depends on EFUSE_DIS_PAD_JTAG (WPU enabled when 0, pin floating when 1); also ADC1_CH3 analog function.
8 MTDI bidirectional JTAG Test Data In, powered from VDDPST1, input enabled at reset; also ADC1_CH4 analog function.
9 VDDPST1 power_in IO power domain supply for digital IO and LP IO pins (VDDPST1).
10 GPIO8 bidirectional LP IO powered from VDDPST1, input enabled at reset and after reset.
11 GPIO9 bidirectional LP IO powered from VDDPST1, input enabled with internal weak pull-up at reset and after reset.
12 GPIO10 bidirectional LP IO powered from VDDPST1; also ZCD0 analog pad voltage comparator function.
13 GPIO11 bidirectional LP IO powered from VDDPST1; also ZCD1 analog pad voltage comparator function.
14 GPIO12 bidirectional LP IO powered from VDDA_PMU/VBAT, with IO MUX functions.
15 XTAL_32K_P bidirectional Positive 32 kHz clock signal connected to the chip oscillator/crystal, powered from VDDA_PMU/VBAT.
16 XTAL_32K_N bidirectional Negative 32 kHz clock signal for external clock input/output, powered from VDDA_PMU/VBAT.
17 CHIP_EN input High enables the chip (powered up), Low disables the chip (powered down); do not leave this pin floating.
18 VBAT power_in Analog power domain or battery power supply input.
19 VDDA_PMU power_in Analog power domain supply input for the power management unit.
20 VDDPST2 power_in IO power domain supply for digital IO pins (VDDPST2).
21 GPIO22 bidirectional Digital IO powered from VDDPST2 with IO MUX functions.
22 U0RXD bidirectional UART0 receive data, powered from VDDPST2, input enabled with internal weak pull-up at reset and after reset.
23 U0TXD bidirectional UART0 transmit data, powered from VDDPST2, input enabled with internal weak pull-up at reset and after reset.
24 GPIO25 bidirectional Digital IO powered from VDDPST2, input enabled at reset and after reset.
25 GPIO26 bidirectional Digital IO powered from VDDPST2, input enabled; default drive strength 40 mA; also USB_D- analog function.
26 GPIO27 bidirectional Digital IO powered from VDDPST2, input enabled with USB pull-up by default; default drive strength 40 mA; also USB_D+ analog function.
27 VDD3P3 power_in Input supply for the analog power domain (VDD3P3).
28 XTAL_N passive External clock input/output connected to the chip crystal or oscillator (negative side of the differential clock).
29 XTAL_P passive External clock input/output connected to the chip crystal or oscillator (positive side of the differential clock).
30 VDD3P3 power_in Input supply for the analog power domain (VDD3P3).
31 VDD3P3 power_in Input supply for the analog power domain (VDD3P3).
32 ANT bidirectional RF LNA input/output signal.
33 GND power_in External ground connection.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 32-VFQFN Exposed Pad
Category RF and Wireless
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Recommended input voltage VDD3P3, VBAT, VDDA_PMU, VDDPST1, VDDPST2 3 3.3 3.6 V 53
Cumulative input current IVDD 0.35 A 53
Ambient temperature TA -40 105 °C 53
Allowed input voltage (input power pins) -0.3 3.6 V 53
Cumulative IO output current 1.3 A 53
Storage temperature TSTORE -40 150 °C 53
Low-level input current IIL 50 nA 53
High-level input current IIH 50 nA 53
DNL (Differential nonlinearity) DNL -8 12 LSB 54
INL (Integral nonlinearity) INL -10 10 LSB 54
Sampling rate 100 kSPS 54
ADC total error -7 7 mV ATTEN0, effective measurement range of 0 ~ 1000 54
ADC total error -8 8 mV ATTEN1, effective measurement range of 0 ~ 1300 54
ADC total error -12 12 mV ATTEN2, effective measurement range of 0 ~ 1900 54
ADC total error -23 23 mV ATTEN3, effective measurement range of 0 ~ 3300 54
Pin capacitance CIN 2 pF 53
High-level source current IOH 40 mA VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 54
Low-level sink current IOL 28 mA VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 54
Internal weak pull-up resistor RPU 45 kΩ 54
Internal weak pull-down resistor RPD 45 kΩ 54
Bluetooth LE current consumption TX 140 mA Bluetooth LE @ 20.0 dBm 55
Bluetooth LE current consumption TX 60 mA Bluetooth LE @ 9.0 dBm 55
Bluetooth LE current consumption TX 36 mA Bluetooth LE @ 0 dBm 55
Bluetooth LE current consumption TX 24 mA Bluetooth LE @ -24.0 dBm 55
Bluetooth LE current consumption RX 24 mA Bluetooth LE RX 55
802.15.4 current consumption TX 140 mA 802.15.4 @ 20.0 dBm 55
802.15.4 current consumption TX 60 mA 802.15.4 @ 9.0 dBm 55
802.15.4 current consumption TX 36 mA 802.15.4 @ 0 dBm 55
802.15.4 current consumption TX 24 mA 802.15.4 @ -24.0 dBm 55
802.15.4 current consumption RX 25 mA 802.15.4 RX 55
Modem-sleep current consumption 10 mA 96 MHz, CPU running, all peripheral clocks disabled 55
Modem-sleep current consumption 17 mA 96 MHz, CPU running, all peripheral clocks enabled 55
Modem-sleep current consumption 6 mA 96 MHz, CPU in idle, all peripheral clocks disabled 55
Modem-sleep current consumption 13 mA 96 MHz, CPU in idle, all peripheral clocks enabled 55
Modem-sleep current consumption 8 mA 64 MHz, CPU running, all peripheral clocks disabled 55
Modem-sleep current consumption 5 mA 64 MHz, CPU in idle, all peripheral clocks disabled 55
Modem-sleep current consumption 7 mA 48 MHz, CPU running, all peripheral clocks disabled 56
Modem-sleep current consumption 11 mA 48 MHz, CPU running, all peripheral clocks enabled 56
Modem-sleep current consumption 5 mA 48 MHz, CPU in idle, all peripheral clocks disabled 56
Modem-sleep current consumption 9 mA 48 MHz, CPU in idle, all peripheral clocks enabled 56
Modem-sleep current consumption 4 mA 32 MHz, CPU running, all peripheral clocks disabled 56
Modem-sleep current consumption 8 mA 32 MHz, CPU running, all peripheral clocks enabled 56
Modem-sleep current consumption 3 mA 32 MHz, CPU in idle, all peripheral clocks disabled 56
Light-sleep current consumption 85 µA CPU and wireless communication modules powered down, peripheral clocks disabled, all GPIOs high-impedance 56
Light-sleep current consumption 25 µA CPU, wireless communication modules and peripherals powered down, all GPIOs high-impedance 56
Deep-sleep current consumption 7 µA RTC timer and LP memory powered on 56
Power-off current consumption 1 µA CHIP_EN set to low level, chip powered off 56

CAD (KiCad official)

  • Symbol: ESP32-H2FH4S
  • Footprint: PCM_Espressif:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
  • 3D model: 32-VFQFN Exposed Pad (KiCad packages3D, STEP)
  • 3D model files: esp32-h2fh4s-etched.step / esp32-h2fh4s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2fh4s.step / esp32-h2fh4s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (69 pp, sha256 2cb42839833eac06, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF