Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

1SMA5930BT3G-MS

MSKSEMI · Zener Diodes · SMA

1SMA5930BT3G-MS from MSKSEMI, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SMA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ 15.2 16 16.8 V @ IZT = 23.4 mA; VZ limits guaranteed at thermal equilibrium (Note 4) 3
Zener voltage tolerance (type suffix B) -5 5 % Note 3: type number indicates tolerance of ±5% 3
Maximum Zener Impedance ZZT 10 Ω @ IZT = 23.4 mA 3
Maximum Zener Impedance ZZK 600 Ω @ IZK = 0.25 mA 3
Reverse Leakage Current IR 0.5 μA @ VR = 12.2 V 3
Maximum DC Zener Current IZM 94 mA(dc) 3
Forward Voltage VF 1.2 V @ IF = 200 mA 3
ESD rating, Human Body Model 16 kV Class 3 per Human Body Model (> 16 kV) 2
DC Power Dissipation @ TL = 75°C, measured zero lead length PD 1.5 W TL = 75°C, measured zero lead length (Note 1) 2
Thermal Resistance, Junction-to-Lead RθJL 50 °C/W Note 1: 1 in square copper pad, FR-4 board 2
DC Power Dissipation @ TA = 25°C PD 0.5 W TA = 25°C (Note 2: FR-4 board, onsemi minimum recommended footprint) 2
Thermal Resistance, Junction-to-Ambient RθJA 250 °C/W Note 2: FR-4 board, onsemi minimum recommended footprint 2
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 2
Maximum case temperature for soldering purposes 260 °C for 10 seconds 2

CAD (KiCad official)

  • Symbol: 1SMA5930BT3G-MS
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: 1sma5930bt3g-ms-etched.step / 1sma5930bt3g-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1sma5930bt3g-ms.step / 1sma5930bt3g-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (7 pp, sha256 84b58db054664c6f, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF