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Contents

README

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TX41601

XDS · DC-DC Converters · ETSSOP-20

TX41601 from XDS, in a ETSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Enable pin: the part is enabled when EN is pulled above 1.2 V and enters shutdown when pulled below 1.0 V, with EN absolute maximum of 100 V to GND.
2 OVLO input Overvoltage lockout input, driven from an external divider to set the input overvoltage threshold; when OVLO is pulled above 1.2 V the controller is disabled and does not resume switching until EN is toggled.
3 OCSET passive Current-limit set point: a resistor from this pin to GND sets the positive and negative cycle-by-cycle current-limit thresholds, with OCSET rated to 6 V absolute maximum.
4 RON passive Switching frequency set: a resistor from this pin to GND programs the switching frequency over 50 kHz to 500 kHz, with RON rated to 6 V absolute maximum.
5 TOFF input Programmable shutdown delay: tie to GND for no delay, leave floating for 10 s, or tie to VCC for 20 s; TOFF absolute maximum is 12 V to GND.
6 SS passive Soft-start: an external capacitor from this pin to GND sets the output start-up time, with SS rated to 6 V absolute maximum.
7 AGND power_in Signal ground for the internal reference and control circuitry.
8 COMP passive Error amplifier output: an external resistor and capacitor network is normally connected from this pin to GND to provide loop compensation, with COMP rated to 6 V absolute maximum.
9 FB input Feedback input sensing the output voltage through a resistor divider from output to GND; FB is a sensitive node that should be kept away from SW and BST, and is rated to 6 V absolute maximum.
10 EXTVCC power_in External supply input for the internal VCC LDO; it bypasses the NDRV LDO when above 10 V, must not exceed 30 V or be connected above VIN, and should be tied to GND if unused.
11 ISNS2 input Inductor current sense input 2 (absolute maximum -0.3 V to 65 V to GND, recommended up to 60 V).
12 ISNS1 input Inductor current sense input 1 (absolute maximum -0.3 V to 65 V to GND, recommended up to 60 V).
13 NDRV output Gate drive output for the external pass device (NMOS or NPN) of the VCC NDRV LDO regulator.
14 VDD power_out Internal supply rail for the IC that is regulated to about 9 V to 10 V and requires at least 4.7 µF of capacitance to GND; VDD is rated to 12 V absolute maximum.
15 PGND power_in Power ground that serves as a separate ground for the MOSFET drivers and should be connected to the system power ground plane.
16 LDRV output Output driver for the low-side MOSFET, rated to 10 V recommended and 12 V absolute maximum to GND.
17 BST power_in Bootstrap supply for the high-side driver, which must be held above the input voltage, with a minimum 0.1 µF high-frequency capacitor connected from this pin to SW; BST is rated to 12 V absolute maximum to SW.
18 SW passive Switch node connected to the source of the upper MOSFET and the drain of the lower MOSFET and serving as the return path for the high-side gate driver; SW ranges from -3 V to VIN+0.3 V to GND.
19 HDRV output Output driver for the high-side MOSFET, rated to 10 V recommended and 12 V absolute maximum to SW.
20 VIN power_in Input voltage: operates from 12 V to 100 V (absolute maximum 100 V to GND).
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer XDS
Package ETSSOP-20
Category Power Management (PMIC)
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输入电压 VIN to GND (绝对最大) VIN -0.3 100 V 4
VFB, VOVLO, VUVLO to GND (绝对最大) VFB, VOVLO, VUVLO -0.3 6 V 4
VTOFF to GND (绝对最大) VTOFF -0.3 12 V 4
VISNS1,2 to GND (绝对最大) VISNS1,2 -0.3 65 V 4
VEN to GND (绝对最大) VEN -0.3 100 V 4
VEXTVCC to GND (绝对最大) VEXTVCC -0.3 30 V 4
VVDD to GND (绝对最大) VVDD -0.3 12 V 4
VRON, VOCSET, VSS, VCOMP to GND (绝对最大) VRON, VOCSET, VSS, VCOMP -0.3 6 V 4
VLDRV to GND (绝对最大) VLDRV -0.3 12 V 4
VHDRV to VSW (绝对最大) VHDRV -0.3 12 V 4
VBST to VSW (绝对最大) VBST -0.3 12 V 4
储存温度范围 TST (绝对最大) TST -65 150 °C 4
结温 TJ (绝对最大) TJ 150 °C 4
引线温度 TL (绝对最大) TL 260 °C 4
ESD 人体模型 HBM VESD 2 kV HBM 人体模型 4
ESD 充电器设备模型 CDM VESD 500 V CDM 充电器设备型号 4
输入电压 VIN to GND (推荐工作) VIN 12 100 V 4
VFB, VOVLO, VUVLO to GND (推荐工作) VFB, VOVLO, VUVLO -0.3 5 V 4
VTOFF to GND (推荐工作) VTOFF -0.3 10 V 4
VISNS1,2 to GND (推荐工作) VISNS1,2 -0.3 60 V 4
VEN to GND (推荐工作) VEN -0.3 100 V 4
VEXTVCC to GND (推荐工作) VEXTVCC -0.3 30 V 4
VVDD to GND (推荐工作) VVDD -0.3 10 V 4
VRON, VOCSET, VSS, VCOMP to GND (推荐工作) VRON, VOCSET, VSS, VCOMP -0.3 5 V 4
VLDRV to GND (推荐工作) VLDRV -0.3 10 V 4
VHDRV to VSW (推荐工作) VHDRV -0.3 10 V 4
VBST to VSW (推荐工作) VBST -0.3 10 V 4
工作结温范围 TJ (推荐工作) TJ -40 125 °C 4
输入电源工作电压范围 VIN 12 100 V 6
稳压输出电压设定点 VOUT 1.2 60 V 6
反馈电压准确性 -1.5 1.5 % 6
VDD 稳压器输出 VDD 9 9.5 10 V 由 NDRV LDO 供应 6
VDD 稳压器输出 VDD 9.5 10 10.5 V 由 EXTVCC LDO 供应 6
软启动电流 ISS 15 20 25 uA SS = 0 V 6
开关频率 FSW FSW 50 200 500 kHz Fsw=Vout/(Rh500p) or Fsw=1/(RL50p) 6
反馈电压 VFB 1.2 V 6
静态电流 IQ 400 uA 开环,VFB = 1.25V,无开关,VIN=48V,TJ=25℃ 6
EN 关断电源电流 ISHUTDOWN 20 uA Close Loop, VEN=0V, VIN=48V 6
VDD 欠压锁定电压 VDD_UVLO 8 V -40°C TJ 125°C 6
VDD 欠压迟滞 VDD_UVLOH 670 mV 6
VBST 欠压锁定电压(VBST 增加) VBST_UVLO 5.6 V -40°C TJ 125°C 6
VBST 欠压迟滞 VBST_UVLOH 860 mV 6
VIN 欠压锁定电压(VIN 增加) VIN_UVLO 6.5 V 6
VIN 欠压迟滞 VIN_UVLOH 650 mV 6
EN 欠压锁定电压(VEN 增加) VEN_UVLO 1.2 V 6
VIN 过压锁定电压参考(VIN 增加) REFIN_OVP 1.2 V 6
源/灌电流 I(Source/Sink) 300 uA 6
跨传导 gm 3 mS 6
OCSET 电压 VOCSET 1.2 V -40°C TJ 125°C 6
值班是 S1-IN S2 限制 (VLIMH) VLIMH 120 mV ROCSET = 25k Ohm, VLIMH=1.2/ROCSET*25K/10 6
下班是 S1-IN S2 限制 (VLIML) VLIML 96 mV ROCSET = 25k Ohm, VLIML=1.2/ROCSET*20K/10 6
过载保护消隐时间 TOVERLOAD 200 ms 6
最短准时 TONMIN 140 ns 6
最短关闭时间 TOFFMIN 400 ns 6
峰值 HDRV 源电流 1 A 7
峰值 HDRV 灌电流 2.2 A 7
峰值 LDRV 源电流 1.8 A 7
峰值 LDRV 灌电流 3.5 A 7
结到环境热阻 θJA 40 °C/W 4
结壳热阻 θJC 23 °C/W 4

CAD (KiCad official)

  • Symbol: TX41601
  • Footprint: Package_SO:ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm
  • 3D model: ETSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: tx41601-etched.step / tx41601-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tx41601.step / tx41601.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XDS datasheet (17 pp, sha256 c126170f7ad9a94e, retrieved 2026-10-09, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF