component
THS3121IDGN
Public Made by Adomby adom
Texas Instruments Operational Amplifier, HVSSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTHS3121IDGN
Texas Instruments · Operational Amplifier · HVSSOP-8-EP
THS3121IDGN from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection; this pin can be left floating or tied to any potential. |
| 2 | VIN- | power_in | Inverting input of the current-feedback amplifier. |
| 3 | VIN+ | power_in | Noninverting input of the current-feedback amplifier. |
| 4 | VS- | power_in | Negative power supply pin, rated from -5 V to -15 V in dual-supply operation. |
| 5 | NC | unconnected | No internal connection; this pin can be left floating or tied to any potential. |
| 6 | VOUT | output | Amplifier output, capable of driving up to 475 mA into a load. |
| 7 | VS+ | power_in | Positive power supply pin, rated from +5 V to +15 V in dual-supply operation. |
| 8 | NC | unconnected | No internal connection; this pin can be left floating or tied to any potential. |
| 9 | PowerPAD | passive | Exposed thermal pad on the package underside, electrically isolated from the die and all leads; solder to a thermally dissipating copper plane (may be tied to VS- or GND) for proper heat sinking. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8-EP |
| Category | Amplifiers/Comparators |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
THS3121IDGN - Footprint:
Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm - 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
ths3121idgn-etched.step/ths3121idgn-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ths3121idgn.step/ths3121idgn.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (41 pp, sha256
7e1cce918ad705c4, retrieved 2026-10-01, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).