component
ESD0801PB
Public Made by Adomby adom
MDD（Microdiode Electronics） ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownESD0801PB
MDD（Microdiode Electronics） · ESD Protection Devices · DFN1006-2
ESD0801PB from MDD（Microdiode Electronics）, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MDD（Microdiode Electronics） |
| Package | DFN1006-2 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| ESD per IEC 61000-4-2 (Air) | VESD | -25 | 25 | kV | IEC 61000-4-2, air discharge; printed ±25 kV | 1 | |
| ESD per IEC 61000-4-2 (Contact) | VESD | -20 | 20 | kV | IEC 61000-4-2, contact discharge; printed ±20 kV | 1 | |
| Operating Temperature | TJ | -55 | 125 | °C | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 1 | ||
| Peak Pulse Power | PPP | 60 | W | tp=8/20us waveform | 1 | ||
| Lead Solder Temperature, Maximum | TL | 260 | °C | 10 s duration | 1 | ||
| Junction Capacitance | CJ | 8 | 15 | pF | VR = 0V, f = 1MHz | 2 | |
| Reverse Working Voltage | VRWM | 5 | V | 2 | |||
| Reverse Breakdown Voltage | VBR | 5.6 | V | IT = 1mA | 2 | ||
| Reverse Leakage Current | IR | 1 | uA | VRWM = 5V | 2 | ||
| Clamping Voltage (IPP = 1A) | VC | 9.5 | V | IPP = 1A, tp = 8/20μs | 2 | ||
| Clamping Voltage (IPP = 4A) | VC | 15 | V | IPP = 4A, tp = 8/20μs | 2 | ||
| Peak Pulse Current | IPP | 4 | A | tP = 8/20us | 2 |
CAD (KiCad official)
- Symbol:
ESD0801PB - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
esd0801pb-etched.step/esd0801pb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd0801pb.step/esd0801pb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MDD（Microdiode Electronics） datasheet (4 pp, sha256
4e0dae50dc0f1027, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).