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Contents

Pinout
Key specifications
Electrical characteristics
CAD (KiCad official)
Provenance

README

markdown

NCP167AMX280TBG

onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)

NCP167AMX280TBG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	OUT	power_out	Regulated output voltage; the output should be bypassed with a small 1 µF ceramic capacitor.
2	GND	power_in	Common ground connection.
3	EN	input	Chip enable: VEN < 0.4 V disables the regulator, VEN > 1.2 V enables the LDO.
4	IN	power_in	Input voltage supply pin, operating range 1.9 V to 5.5 V.
5	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	onsemi
Package	XDFN-4-EP(1x1)
Category	Power Management ICs
Pins	5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Operating Input Voltage	VIN	1.9		5.5	V	-40°C ≤ TJ ≤ 125°C	3
Output Voltage Accuracy	VOUT	-2		2	%	VIN = VOUT(NOM) + 1 V to 5.5 V, 0 mA ≤ IOUT ≤ 700 mA	3
Output Current Limit	ICL	800	1000		mA	VOUT = 90% VOUT(NOM)	3
Quiescent Current	IQ		9.7	18	µA	IOUT = 0 mA	3
Shutdown Current	IDIS		0.01	1	µA	VEN ≤ 0.4 V, VIN = 4.8 V	3
EN Input Voltage High	VENH	1.2			V	EN Input Voltage "H"	3
EN Input Voltage Low	VENL			0.4	V	EN Input Voltage "L"	3
EN Pull Down Current	IEN		0.2	0.5	µA	VEN = 4.8 V	3
Line Regulation	LineReg		0.02		%/V	VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V	3
Load Regulation XDFN4	LoadReg		0.002		%/mA	IOUT = 1 mA to 700 mA, XDFN4	3
Short Circuit Current	ISC		1050		mA	VOUT = 0 V	3
Turn-On Time			120		µs	COUT = 1 µF, From assertion of VEN to VOUT = 95% VOUT(NOM)	3
Output Voltage Noise	VN		8.5		µVRMS	f = 10 Hz to 100 kHz, IOUT = 20 mA	3
Thermal Shutdown Threshold rising	TSDH		160		°C	Temperature rising	3
Thermal Shutdown Threshold falling	TSDL		140		°C	Temperature falling	3
Active output discharge resistance	RDIS		280		Ω	VEN < 0.4 V, Version A only	3
Input Voltage	VIN	-0.3		6	V		2
Output Voltage	VOUT	-0.3		6	V	-0.3 to VIN + 0.3, max. 6 V	2
Chip Enable Input	VCE	-0.3		6	V	-0.3 to VIN + 0.3, max. 6 V	2
Maximum Junction Temperature	TJ			150	°C		2
Storage Temperature	TSTG	-55		150	°C		2
ESD Capability, Human Body Model	ESDHBM			2000	V		2
ESD Capability, Machine Model	ESDMM			200	V		2
Thermal Resistance, Junction-to-Air XDFN4	RθJA		198		°C/W	XDFN4, JEDEC JESD51-7 board	2

CAD (KiCad official)

Symbol: NCP167AMX280TBG
Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
3D model files: ncp167amx280tbg-etched.step / ncp167amx280tbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp167amx280tbg.step / ncp167amx280tbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: onsemi datasheet (13 pp, sha256 2aee919f594b3828, retrieved 2026-10-23, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF