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Contents

README

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U0239

UNI-SEMIC · DC-DC Converters · SOT-23-6

U0239 from UNI-SEMIC, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BS passive Bootstrap pin; a capacitor connected between SW and BST pins is required to form a floating supply across the high-side switch driver.
2 GND power_in Ground pin.
3 FB input Adjustable version feedback input; connect FB to the center point of the external resistor divider (0.6V reference, absolute max -0.3 to 6V).
4 EN input Drive to logic-high to enable the IC and to logic-low to disable it and enter micro-power shutdown mode (absolute max -0.3 to 36V).
5 IN power_in Power supply pin with 4V to 30V operating input range (absolute max -0.3 to 36V).
6 SW passive Switching pin (absolute max -0.3 to VIN+0.5V).

Key specifications

Parameter Value
Manufacturer UNI-SEMIC
Package SOT-23-6
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage Range VIN 4 30 V 4
Supply Current in Operation 0.4 0.6 mA VEN=3.0V, VFB=1.1V 4
Supply Current in Shutdown 1 μA VEN =0 or EN = GND 4
Regulated Feedback Voltage VFB 0.585 0.6 0.615 V TA = 25°C, 4V≤VIN ≤18V 4
High-Side Switch Leakage Current 1 uA VEN=0V, VSW=12V 4
Maximum Duty Cycle 93 % VFB=0.6V 4
Soft Start 1.2 mS 4
High-Side Switch On-Resistance 90 mΩ 4
Low-Side Switch On-Resistance 80 mΩ 4
Upper Switch Current Limit 3 A Minimum Duty Cycle 4
Oscillation Frequency 0.5 MHz 4
Minimum On-Time 60 nS 4
Minimum Off-Time 140 nS 4
Thermal Shutdown 160 ℃ 4
Thermal Hysteresis 20 ℃ 4
VIN, EN Voltage -0.3 36 V 4
VSW Voltage VSW -0.3 V upper limit (VIN+0.5) V 4
VFB Voltage VFB -0.3 6 V 4
Operating Temperature Range -40 85 °C 4
Storage Temperature Range -65 150 °C 4
Lead Temperature (Soldering, 10s) 300 °C Soldering, 10s 4
ESD (Human Body Model) HMB 2 KV 4
ESD (Machine Model) MM 200 V 4
Thermal Resistance Junction to Ambient 230 °C/W 4
Thermal Resistance Junction to Case 130 °C/W 4

CAD (KiCad official)

  • Symbol: U0239
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: u0239-etched.step / u0239-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); u0239.step / u0239.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UNI-SEMIC datasheet (12 pp, sha256 acbdbc28e99d030c, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF