component
AS2333M8-13
Public Made by Adomby adom
Diodes Incorporated Operational Amplifier, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Contents
README
markdownAS2333M8-13
Diodes Incorporated · Operational Amplifier · MSOP-8
AS2333M8-13 from Diodes Incorporated, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Output, channel A. |
| 2 | -INA | input | Inverting input, channel A. |
| 3 | +INA | input | Noninverting input, channel A. |
| 4 | V- | power_in | Negative power supply; in single supply application it is normally tied to ground, and in split supply a minimum 0.1μF decoupling capacitor is recommended between V- and GND as close as possible. |
| 5 | +INB | input | Noninverting input, channel B. |
| 6 | -INB | input | Inverting input, channel B. |
| 7 | OUTB | output | Output, channel B. |
| 8 | V+ | power_in | Positive power supply; a minimum 0.1μF decoupling capacitor should be placed between V+ and GND as close as possible. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | MSOP-8 |
| Category | Operational Amplifier/Comparator |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage Range | VS = V+ - V- | 6.5 | V | 3 | |||
| Signal Input Terminals current | -1 | 1 | mA | 3 | |||
| Storage Temperature | TSTG | -65 | 150 | °C | 3 | ||
| Maximum Junction Temperature | TJ | 150 | °C | 3 | |||
| Lead Temperature (Soldering, 10 Seconds) | TLEAD | 260 | °C | 10 seconds soldering | 3 | ||
| ESD HBM Human Body Model ESD Protection | 4 | kV | 3 | ||||
| ESD CDM Charged-Device Model ESD Protection | 1 | kV | 3 | ||||
| Supply Voltage Range (recommended) | VS = V+ - V- | 1.8 | 5.5 | V | 3 | ||
| Operating Ambient Temperature Range | TA | -40 | 125 | °C | 3 | ||
| Input Offset Voltage | VOS | 8 | 22 | μV | VS = 5V | 4 | |
| Input Offset Voltage Drift | ∆VOS/∆T | 0.02 | 0.1 | μV/°C | TA = -40°C to +85°C | 4 | |
| Input Offset Voltage Drift | ∆VOS/∆T | 0.2 | μV/°C | TA = -40°C to +125°C | 4 | ||
| Power-Supply Rejection Ratio | PSRR | 1 | 5 | μV/V | VS = 1.8V to 5.5V, TA = -40°C to +125°C | 4 | |
| Input Bias Current | IB | -200 | 70 | 200 | pA | TA = +25°C | 4 |
| Input Offset Current | IOS | -400 | 140 | 400 | pA | 4 | |
| Common-Mode Rejection Ratio | CMRR | 106 | 120 | dB | (V-) - 0.1V < VCM < (V+) + 0.1V, TA = -40°C to +125°C | 4 | |
| Open-Loop Voltage Gain | AOL | 106 | 130 | dB | (V-) + 100mV < VO < (V+) - 100mV, RL = 10kΩ, TA = -40°C to +125°C | 4 | |
| Voltage Output Swing from Positive Rail | 30 | 50 | mV | RL = 10kΩ, TA = +25°C | 4 | ||
| Voltage Output Swing from Positive Rail | 70 | mV | RL = 10kΩ, TA = -40°C to +125°C | 4 | |||
| Voltage Output Swing from Negative Rail | 10 | 50 | mV | RL = 10kΩ, TA = +25°C | 4 | ||
| Voltage Output Swing from Negative Rail | 70 | mV | RL = 10kΩ, TA = -40°C to +125°C | 4 | |||
| Specified Voltage Range | VS | 1.8 | 5.5 | V | 4 | ||
| Quiescent Current per Amplifier | IQ | 12 | 20 | μA | IO = 0A, TA = +25°C | 4 | |
| Quiescent Current per Amplifier | IQ | 28 | μA | IO = 0A, TA = -40°C to +125°C | 4 | ||
| Junction-to-Ambient Thermal Resistance MSOP-8 | RθJA | 184 | °C/W | 3 | |||
| Junction-to-Case Thermal Resistance MSOP-8 | RθJC | 18 | °C/W | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.075 grams (Approximate) | 14 |
CAD (KiCad official)
- Symbol:
AS2333M8-13 - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
as2333m8-13-etched.step/as2333m8-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);as2333m8-13.step/as2333m8-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (15 pp, sha256
1542ebdcbf84a368, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusoff(skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).